RF & Microwave Industry News

RSS

RADX Technologies will demo the LibertyGT 1211B COTS, modular, multifunction software defined synthetic instrument (SDSI) at IEEE IMS 2015, Booth # 310.

Mobile operators worldwide can now deploy LTE, 5G and small cell networks faster with a new family of jumper cables equipped with next-generation connectors from Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist. Based on the 4.3-10 interface standard, the new addition to the RFS product portfolio leverages RFS innovations in Passive Intermodulation (PIM) and cable corrugation to deliver jumpers with the highest voltage standing wave ratio (VSWR) and PIM performance available in jumper cables with similar connectors.

 To meet increasing demands from the automotive market, Knowles capacitor brand Syfer Technology has improved its offering of AEC-Q200 qualified devices.  In particular Multilayer Ceramic Capacitors (MLCC’s) and EMI filter products have extended ranges. 

Richardson RFPD Inc. announces its attendance and participation at the 2015 IEEE MTT International Microwave Symposium (IMS), the premiere international gathering for all aspects of microwave theory and practice.

Huawei has launched its European Research Institute located in Leuven, Belgium. As a key tool for helping Europe achieve the targets of its Digital Agenda, the Institute will further strengthen the ongoing partnership between Huawei and European industry.

Remtec Inc. has expanded its process capabilities and developed new techniques to manufacture high performance metallized ceramic sensors in a variety of diverse applications. These include motion/velocity and acceleration systems, electrical measurement (capacitance and resistance), medical monitoring, diagnostic and detection, optical such as light sources, infrared detectors and fiber optics, liquid and gas flow, biosensors, temperature and thermal conductivity as well as wireless sensors.

NI, the provider of solutions that enable engineers and scientists to solve the world’s greatest engineering challenges, announced the opening of the new Wireless Innovation Lab at its Austin, Texas headquarters.

MACOM designers used NI AWR Design Environment™ software inclusive of Microwave Office circuit design software, AXIEM 3D planar EM simulator, Analyst™ 3D FEM simulator, and APLAC harmonic balance (HB) simulator to successfully design and simulate a 4 W Ka-band PA using a 2 mil thick 0.15 um GaAs pseudomorphic high-electron mobility transistor (pHEMT) process.