RF & Microwave Industry News

IMS2016 Special Panel Session: 5G IoT Conundrum

May 25, IMS MicroApps Theater, Noon-1:00 pm

While 5G research continues at a rapid pace to develop very high-speed, low latency networks, the IoT market has opposite needs for a relatively low data rate, very low power network that can support millions of devices and sensors. How can these be reconciled or do we need to develop separate networks? How do the current 3G/ 4G networks and possible discontinuation of 2G play into the picture? How about WiFi and some of the newly developed low power wide area network concepts? This panel of experts will debate possible solutions, how they affect the wireless market and possible future directions.


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Richardson Electronics at IMS2016

Disruptive technologies and products featured in the “Think Tank” at Booth #2350

Richardson Electronics Ltd. announces its participation at the 2016 IEEE International Microwave Symposium (IMS2016). IMS2016, organized by the IEEE Microwave Theory and Technique Society (MTT-S), is the premier conference for attendees to learn about the latest information in the RF and microwave industry.


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Laser Services to exhibit at IMS2016

Laser Services, an ISO 9001:2008 - AS9100C and ITAR registered laser job shop, will be exhibiting at the 2016 International Microwave Symposium (IMS) in San Francisco, Calif., being held from May 22–27, in booth #1853. They will be discussing their services and techniques for RF and microwave applications.


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Ardent Concepts releases industry's highest bandwidth multicoax connector

Ardent Concepts Inc., a leading designer and manufacturer of high performance GHz connectors used in the development of next generation semiconductor applications and systems has again pushed bandwidth barriers with a 70 GHz configuration of its innovative TR Multicoax series connectors. TR 70 realizes Ardent’s mission to bring tomorrows connector solutions to market today. With exceptionally low loss, TR 70 ensures quicker, more accurate, and more repeatable functional test of cutting-edge IC applications.


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