RF & Microwave Industry News

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Ampleon announced the availability of a new package platform that will be rolled out across the entire LDMOS and GaN product portfolio. Over a dozen variants of the SOT502 and SOT539 platforms are in development.

Comtech Telecommunications Corp. announced that during its fourth quarter of fiscal 2016, its subsidiary, Comtech Systems Inc., received an order from a foreign prime contractor for approximately $7 million to design and install a number of fixed troposcatter terminals. The systems will be used by a foreign military end-customer for communications between off-shore islands.

See AR at IMS2016 in San Francisco, Calif., Booth #1711. While at AR's booth, ask about their industry-leading high power solid state CW amplifiers. Products include a Class A RF amplifier capable of delivering over 50,000 W with -40 dBc minimum harmonic performance, a 10,000 W linear amplifier covering the entire 80 to 1000 MHz frequency band and a 3000 W, 1 to 2.5 GHz amplifier.

Metrigraphics, a leading process development and manufacturing resource for sub-miniature circuits and electroformed structures, will feature its latest micron-scale flexible circuits and thin film devices at IMS, May 24–26 in San Francisco, Calif.

Wolfspeed, A Cree Company and a leading global supplier of GaN-on-SiC high electron mobility transistors (HEMTs) and monolithic microwave integrated circuits (MMICs) with best-in-class reliability, will highlight its latest industry-leading RF and microwave devices and foundry services at this year’s IEEE International Microwave Symposium (IMS2016), scheduled for May 22–27, 2016 in San Francisco, Calif.. The company is also supporting the IMS 2016 STEM program, and several onsite student design competitions.

Qorvo®, a leading provider of core technologies and RF solutions for mobile, infrastructure and defense applications, announced the availability of a ZigBee 3.0 software development kit (SDK) for Smart Home gateways that incorporate the new GP712 radio communication controller chip from GreenPeak Technologies (now the Low Power Wireless business unit of Qorvo).

Richardson RFPD Inc. announced that its distribution of a large portfolio of serial digital interface (SDI) video and optoelectronics products from M/A-COM Technology Solutions has expanded into Europe.

W. L. Gore & Associates introduced an online tool designed to complement the existing GORE™ Microwave/RF Assembly Builder. The new GORE™ Microwave/RF Assembly Calculator is used to calculate insertion loss, VSWR and other parameters of GORE® Microwave/RF Assemblies for different cable types. The calculator is particularly useful when the initial cable type is unknown and needs to be specified independent of the connector.

EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, has announced the participants in this year’s Technical Advisory Committee.

HUBER+SUHNER, is debuting its Quick-Fit plus connector system for ½” corrugated cables used in Distributed Antenna Systems, at SCWS World 2016 in London.