RF & Microwave Industry News

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Pasternack has announced that they will be exhibiting at this year’s IEEE International Microwave Symposium (IMS2017) in Honolulu from June 4^th to 9^th at the Hawaii Convention Center.

On Tuesday June 6, Empower RF’s CTO , Paulo Correa, will be presenting the "Multi-Use Interoperable RF Amplifier" topic to an audience of IMS attendees at the Exhibitor Workshop from 1 to 3 p.m. in Room 318/319 of the Hawaii Convention Center.

RFMW Ltd. announces design and sales support for a series of high power amplifiers from Skyworks Solutions. The SKY6629x-11 series includes eight models of high-efficiency (~35 percent at Pout = +28 dBm), 4 W amplifiers covering frequency bands from 700 to 3800 MHz. Targeted for the fast growing enterprise small cell market, these 4 W PAs meet higher data rate and lower power consumption requirements for indoor and outdoor enterprise systems

Amphenol RF introduces ANSYS HFSS 3D component models of PCB connectors intended to streamline the design of new products and eliminate the need for physical prototyping.

The latest release of the Modelithics COMPLETE Library for NI AWR Design Environment, version 17.1, is now available, containing 44 new models and introducing several new model features.

Texas Instruments (TI) has introduced single chip, CMOS, 76 to 81 GHz sensors for automotive and industrial applications. The AWR1x automotive and IWR1x industrial families comprise three different options for automotive and two for industrial. Each chip has a range up to 300 m, a sensing resolution less than 4 cm and range accuracy less than 50 µm.