RF & Microwave Industry News

EDI CON USA Announces 2017 Conference Chairs

EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, will take place at the Hynes Convention Center, September 11-13 in Boston, Mass. The event management team announced this year’s conference chairs: Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. will serve as the chair for the high-frequency subject areas, and Istvan Novak, senior principal engineer at Oracle, will serve as the chair for the high-speed digital areas of the conference.


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Peregrine Announces Volume Production Parts for UltraCMOS 60 GHz 
RF SOI Switches

Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces immediate availability of volume production parts for their UltraCMOS® 60 GHz RF SOI switches. The PE42525 and PE426525 extend Peregrine’s high frequency portfolio into frequencies previously dominated by gallium-arsenide (GaAs) technology.


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Breakthrough GaAs MMIC Wideband Low Phase Noise Amplifier Family Delivers Extremely Low Phase Noise

Custom MMIC, a leading developer of performance driven monolithic microwave integrated circuits (MMICs), has added new category to their rapidly expanding standard product offerings. Custom MMIC’s new GaAs MMIC Low Phase Noise Amplifier family offers previously unattained phase noise performance. Phase noise is a critical requirement which defines the performance level of most radars and communications systems.


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Compact 25W Ku-Band Transceiver With GaN SSPA for Commercial Airborne Applications

TRAK Microwave, a Microwave brand of Smiths Interconnect, has announced the addition of the Ku-Band High Power Transceiver to its wide range of product offerings. TRAK’s new HPT functions as a complete airborne Satcom solution, integrating the necessary GaN SSPA, upconverters, downconverters, and digital control technology to offer a highly modular yet easily maintained system complete with advanced interoperability features and multiple Built-in-Test (BIT) functions.


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Signal Integrity Journal Launches With Seven Industry Leading Sponsors

Signal Integrity Journal, a new sister publication to Microwave Journal covering signal integrity, power integrity and EMC/EMI related topics, has secured seven sponsors to start the new year. The Platinum Level sponsorships are sold out for 2017 with industry leaders Rohde & Schwarz, Anritsu, Mentor Graphics and CST filling the top sponsorship level. Joining them are Cadence and Samtec at the Gold Level and Passives Plus at the Silver Level.


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Rogers Corp. to Exhibit Advanced Circuit and Thermal Management Materials at DesignCon 2017

Rogers Corp.'s Advanced Connectivity Solutions (ACS) will feature examples of its high-performance circuit and thermal management materials for the most demanding electronic designs and working environments at DesignCon 2017, January 31-February 2, 2017 (exhibition from February 1-2, 2017) in the Santa Clara Convention Center (Santa Clara, CA). DesignCon is a premiere event for electronic design engineers working on circuit and system levels.


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