RF & Microwave Industry News

Knowles X8R MLCCs Go Non-Mag With New Dielectric Formulation

Knowles Capacitors is pleased to announce that their ongoing material development process has qualified an X8R dielectric material to be Lead (Pb) free. This is part of Knowles environmental commitment to continuously develop materials that are more environmentally friendly, as well as ensuring continued compliance to the existing requirements along with potential future changes to the EU RoHS directive.


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Keysight Technologies Addresses 400G/PAM-4 Test Challenges at DesignCon 2017

Keysight Technologies Inc. announced it will exhibit its latest high-speed digital solutions at DesignCon 2017, Booth 725, Santa Clara Convention Center, Feb. 1-2. Keysight's technical experts and application engineers will demonstrate the most advanced design and test solutions, developed for solving today's most difficult high-speed digital measurement challenges. Keysight is proud to be the host sponsor of DesignCon 2017.


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Passive Plus Inc. Introduces Broadband 100nF Multilayer Ceramic Capacitors

Passive Plus Inc. introduces the 01005BB104 broadband 100nF multilayer ceramic capacitors. The 01005BB104 – the industry’s smallest 100nF broadband part characterized for RF performance — has a case measuring (mils) 16 x 8 x 8, and offers resonant-free RF coupling/DC blocking from 16 KHz (lower 3-dB frequency) to beyond 65 GHz with < 1 dB insertion loss and < -15 dB return loss on suitable substrates. The 01005BB104 is rated at a DC working voltage (WVDC) of 4 and is available in a nickel-tin termination.


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EDI CON USA Announces 2017 Conference Chairs

EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, will take place at the Hynes Convention Center, September 11-13 in Boston, Mass. The event management team announced this year’s conference chairs: Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. will serve as the chair for the high-frequency subject areas, and Istvan Novak, senior principal engineer at Oracle, will serve as the chair for the high-speed digital areas of the conference.


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