RF & Microwave Industry News

Plastic-packaged FETs for High Power Applications

GaAs MESFET devices that are housed in a low cost plastic package and feature high linearity
Plastic-packaged FETs for High Power Applications Amcom Communications Inc. Clarksburg, MD With the advent of wireless communications, demands have increased for high power, high linearity and inexpensive power amplifiers. Devices capable of handling high power along with high linearity are being used to design power amplifiers that achieve the...
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A Multilayer Press for Rapid PCB Prototype Fabrication

A new tabletop multilayer press for rapid PCB prototyping that permits multilayer designs to be fabricated in the engineering lab for rapid evaluation
A Multilayer Press for Rapid PCB Prototype Fabrication LPKF Laser & Electronics, USA Wilsonville, OR Until now fabricating prototype multilayer PCBs has been a costly and time-consuming endeavor. Although single-layer prototype boards traditionally are constructed in house, designers have been forced to go to outside shops for their prototype...
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A Multilevel Design Environment for Wireless System Development

The Microwave Office Design Suite (WDS), which provides a new level of realism when predicting practical system performance through the use of computer-aided engineering techniques
A Multilevel Design Environment for Wireless System Development Applied Wave Research Inc. (AWR) El Segundo, CA Simulation techniques have been in use for many years to support the design and evaluation of RF and microwave systems. During the past three decades, computer-aided engineering (CAE) techniques have matured and are...
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Shaped Sector Antennas for LMDS and MMDS Hubs

A new line of hub sector antennas for the 24 to 42 GHz local multipoint distribution system (LMDS) and 2.1 to 2.7 GHz multichannel multipoint distribution system (MMDS) wireless access frequency bands
Shaped Sector Antennas for LMDS and MMDS Hubs REMEC Magnum Inc. San Jose, CA A line of hub sector antennas for the 24 to 42 GHz local multipoint distribution system (LMDS) and 2.1 to 2.7 GHz multichannel multipoint distribution system (MMDS) wireless access frequency bands has been recently introduced....
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BENEFITS OF AUTOMATED RIBBON BONDING FOR MICROWAVE APPLICATIONS

Ribbon wire vs. round wire bonding as the high frequency package interconnect of choice
TECHNICAL FEATURE BENEFITS OF AUTOMATED RIBBON BONDING FOR MICROWAVE APPLICATIONS BRADLEY K. BENTON Palomar Technologies Inc. Vista, CA With today's ever-increasing need for larger bandwidth in telecommunications, datacom, aerospace and defense applications, packaging challenges continue to grow. As the frequency at which the packages are required to operate increases,...
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AN ANALYSIS OF ENCLOSED COPLANAR STRIPS

Simple closed-form equations for characteristic impedance and effective dielectric constant for conductor-backed coplanar strips as well as the effect of a top ground cover
TECHNICAL FEATURE AN ANALYSIS OF ENCLOSED COPLANAR STRIPS Abstract: With the increasing use of high speed digital circuits in modern electronic devices, coplanar stripline (CPS) transmission lines are of major importance as interconnecting lines. For example, the high speed digital circuits used in differential receivers operate best when fed...
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DC, LINEAR AC AND NONLINEAR AC STABILITY ANALYSIS USING BIFURCATION AND NYQUIST THEORY

Stabilty analysis using Nyquist and bifurcation criteria, which avoid the limitations of traditionally used stability parameters and enable designers to achieve better performance from their circuits
TECHNICAL FEATURE DC, LINEAR AC AND NONLINEAR AC STABILITY ANALYSIS USING BIFURCATION AND NYQUIST THEORY JAKE GOLDSTEIN AND MEHDI SOLTAN Xpedion Design Systems Inc. Santa Clara, CA Designing power and low noise amplifiers, gain blocks, multipliers and oscillators for modern communication systems requires delicate trade-offs between various design specifications...
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MODULATION IMPERFECTIONS IN IS54/136 DUAL-MODE CELLULAR RADIO

Typical modulation errors related to the RF and digital sections of a dual-mode (TDMA/AMPS) cellular phone front end, and development of calibration methods to effectively minimize internal modulator errors through analysis of the output signal
TECHNICAL FEATURE MODULATION IMPERFECTIONS IN IS54/136 DUAL-MODE CELLULAR RADIO Abstract: Nonideal in-phase and quadrature (IQ) calibration circuits on one hand, and the synthesizer's phase noise spurious response and carrier leakage on the other, affect modulation quality by degrading modulation parameters such as error vector magnitude (EVM), spectral mask and...
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DC and Pulsed IV Chracteristics of GaAs MESFET Devices

A variety of IV measurements performed inder DC and pulsed conditions that illustrate the strong influence of frequency dispersion and self-heating effects on device characteristics
DC and Pulsed IV Characteristics of GaAs MESFET Devices New measurement procedures using a DC and pulsed IV characterization system illustrate the significant effect that the thermal and frequency dispersion phenomena in GaAs MESFETs have on the IV characteristics of the device. The new procedures presented enable the effects...
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Duplexer Considerations for X-Band T/R Modules

The capabilities of the three most common duplexer configurations as well as supporting component design considerations
Duplexer Considerations for X-band T/R Modules A transmit/receive (T/R) module’s duplexer plays a critical role in determining a phased array’s reliability, radar cross section (RCS) and performance. Several different block diagrams are typically used to realize the duplexer, but many common configurations do not satisfy basic duplexer requirements. This...
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