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A 10 W 2 GHz Silicon Carbide MESFET Cree Research Durham, NC One of the major problems facing traditional silicon and GaAs high power semiconductor devices is junction temperature. The devices’ high currents inevitably generate excessive heat that must be dissipated to keep the junction temperature within acceptable limits....

Positive Bias GaAs Multithrow Switches with Integrated TTL Decoders Hittite Microwave Corp. Chelmsford, MA Distribution and reception of digital, video and voice information has become an essential part of our daily routine. We use a network of fiber-to-RF cable to communicate with family, friends and coworkers via the Internet;...

A 6 W MMIC Power Amplifier for 6 GHz Operation GaAsTEK, a unit of ITT Industries Roanoke, VA The current trend for microwave power amplifiers is higher power and efficiency without sacrificing good linear gain. Today’s circuit designer must satisfy these requirements while also meeting stringent size and cost...

Cavity and Surface-mount Delay Line Filters for Feedforward Power Amplifiers K&L Microwave Inc. Salisbury, MD In their quest for reduced levels of intermodulation distortion (IMD), power amplifier manufacturers utilize feedforward techniques to implement either multiple carrier power amplifiers or single wideband carrier power amplifiers. The feedforward technique relies on...

A Small CDMA Module for Wireless PCS Handsets ANADIGICS Warren, NJ The rapid growth of wireless handsets has created pressure on RF design engineers to provide feature-rich, timely solutions that allow market success. Time to market from concept to volume ramping for production has become a key issue in...

Miniature Tight-tolerance Chip Inductors Toko America Inc. Mt. Prospect, IL Today’s trend toward smaller circuits and automated assembly is pushing component manufacturers to develop new and innovative ways to reduce the size and cost of their products while maintaining or improving performance. High frequency inductors traditionally have been a...

Europe’s Wireless Futures European technologies and market prospects continue to play a critical role in the wider picture of the worldwide wireless and mobile scene. This special supplement to Microwave Journal provides an overview of developments in Europe’s key wireless technologies and looks at trends for the future. Stephen...

RF/Microwave Power Package Reliability: The Effects of Component Materials and Assembly Processes The mechanical performance and reliability of various Al 2 O 3 ceramics were evaluated with intended applications as insulator frames for RF/microwave power packages. Considering variations in base-flange material properties (CuW, CuMoCu), base-flange thickness (0.040", 0.020"), assembly...

Technical Feature Design of High Gain Microstrip Antennas Frank Zavosh and James T. Aberle Please click here to view the pdf file of the Technical Feature  ...

Microstrip Resonant Phase Shifters Matjaz Vidmar University of Ljubljana Slovenia There are several possible designs for adjustable phase shifters (or adjustable delay lines) depending on the operating frequency, required bandwidth, power handling and technology used (mechanical, ferrite, PIN diode, varactor or I/Q modulator). This article describes the particular problem...