RF & Microwave Industry News

Laird Technologies Acquires AeroComm

Laird Technologies , a designer and manufacturer of antenna solutions, electromagnetic interference (EMI) shielding products, telematics, signal integrity products and thermal management solutions, announced the acquisition of AeroComm for $38 M. AeroComm is a designer and manufacturer of wireless communications systems for low- to mid-volume OEM applications where high...
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NXP and TSMC Strengthen R&D Cooperation

NXP Semiconductors and TSMC will strengthen their cooperation to include advanced R&D in CMOS process technologies as well as having a manufacturing partnership. The strengthened global R&D cooperation will be built upon the existing NXP research organization at the IMEC facilities in Leuven, Belgium, and TSMC corporate R&D in...
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EPCOS Goes On-line With China RoHS Information

EPCOS now offers its customers an on-line service to help them comply with the requirements of China’s new law on hazardous substances in electronic products. China RoHS, officially the Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP), regulates products containing any of six hazardous substances:...
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SUSS Bonds with MEMS Research Lab in Mexico

The University of Juarez (UACJ), Mexico, has selected SUSS MicroTec ’s advanced wafer bonding equipment for its research laboratory. UACJ is an integral member of the Paso del Norte (PDN) Regional MEMS Cluster and a key player in supporting bi-national innovation and entrepreneurial development in Mexico. The cluster consists...
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3GSM 2007 Gets the Party Started

On Monday (12 February) the 2007 3GSM World Congress commenced and by the time the doors close on the world’s premier mobile event on Thursday (15 February) it is expected that over 60,000 visitors will have frequented the Fira de Barcelona Conference and Exhibition Center. Socially the event got...
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Agilent To Expand Investment In Device Modeling

Agilent Technologies Inc. announced plans to expand the company's investment in its Integrated Circuit Characterization and Analysis Program (IC-CAP) device modeling software. The company will establish a new research and development modeling center in Asia to better serve the industry's leading semiconductor foundries and to respond to advancements in...
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Comtech Receives $9.5 M For MTS Contract

Comtech Telecommunications Corp. announced that its Maryland-based subsidiary, Comtech Mobile Datacom Corp., received orders totaling $9.5 M on its Movement Tracking System, or MTS contract, with the U.S. Army. The total includes $8.9 M of MTS program orders and $0.6 M in follow-on orders for the Army National Guard's...
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Thales Uses EMC Simulation To Reduce Testing Costs

Thales Technical Unit Control and Display Systems (CDS) uses electromagnetic compatibility (EMC) simulation to reduce testing costs on each new cockpit instrument. EMC is a major design challenge in cockpit instruments because they have a clear face which makes them difficult to shield. FLO/EMC electromagnetic simulation software from Flomerics...
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Silicon Labs Reaches Agreement With NXP

Silicon Laboratories Inc. , a leader in high performance, analog-intensive, mixed-signal integrated circuits (IC), announced a definitive agreement with NXP , formerly Philips Semiconductor. NXP will purchase the Aero transceiver, AeroFONE™ single-chip phone and power amplifier product lines, for $285 M in cash, with additional earn-out potential of up...
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