RF & Microwave Industry News

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SiGe Semiconductor Inc. announced two new power amplifiers that provide manufacturers with the lowest cost route to developing Wi-Fi systems. The SE2537L and SE2581L power amplifiers are RF building blocks that simplify development and reduce cost of discrete Wi-Fi implementations in client access applications including laptop computers, gaming systems,...

Having evolved from Motorola’s Smart Networks Developer Forum (SNDF), which ran from 2001 to 2004, the Freescale Technology Forums (FTFs) began in 2005, following the spin off of Freescale from Motorola the previous year. All FTF events include technical training sessions, keynote presentations and an interactive Technology Lab. The...

StratEdge , a leader in the design and production of semiconductor packages for microwave, millimeter-wave and high speed digital devices, announced it has moved its headquarters to new, state-of-the-art facilities. Still located in San Diego, CA, the new site enables StratEdge to increase capabilities and space for package design,...

As demand grows for more data, mobile web access, video on demand, and a number of other broadband wireless services, considerable engineering resources are now focused on developing the next big thing in wireless communication. With goals set to exceed the limits of cellular and WLAN, the mobile WiMAX...

Test Tooling Solutions Group (TTSG), a global manufacturer of ATE test toolings for the semiconductor industry, has adopted Ansoft Corp. 's PCB Design Suite, including HFSS™, Nexxim®, Ansoft Designer® and Optimetrics™. TTSG's adoption of the Suite extends the firm's core design competency, strengthens its pool of intellectual property assets...

The US Navy has awarded Raytheon Co. a $45 M contract to perform performance-based logistics for the AEGIS weapons system from 2007 through 2012. Raytheon Integrated Defense Systems will perform repairs and provide spares for the AN/SPY-1 radar and MK 99 Fire Control System, both key components of the...

Pad scalability corresponds to the ability to change the dimensions of the bonding or solder pad used for attachment of a surface mount component. In this paper, a new pad scalability feature added to selected Global Models contained in Modelithics CLR Library[1,2] is discussed. We demonstrate the excellent correlation...

Agilent Technologies Inc. and Anite plc announced that they have entered into a strategic partnership to deliver industry-leading 3GPP Long Term Evolution (LTE) test solutions to wireless R&D engineers designing next-generation mobile communications products. Under the terms of this partnership, Agilent and Anite will provide a broad, comprehensive portfolio...

The papers presented at the SJ Technologies sponsored ARMMS conference in Corby, UK, on 5 and 6 November, covered a wide range of topics in the RF and microwaves sector. The Society is a non-profit, independent professional society comprised of electronics engineers with an interest in high frequency design...

The 3 rd SAR-Lupe satellite, carrying Thales Alenia Space Sensor Electronic Units, which form the core of the Synthetic Aperture Radar that will provide high-resolution images to the German Ministry of Defence, has been boosted into orbit. The SAR-Lupe program, which has a lifetime of 10 years, comprises a...