RF & Microwave Industry News

RFMD, Motorola Mobility and HTC to be investigated by U.S. ITC

Peregrine Semiconductor Corp. (Peregrine), a leading provider of high-performance radio-frequency (RF) integrated circuits (ICs) announced that the U.S. International Trade Commission (ITC) has launched an investigation into whether RF Micro Devices Inc. (RFMD) products infringe certain Peregrine patents relating to RF ICs and switch technology. The action and investigation further include Motorola Mobility Inc. and HTC Corp. (HTC), whose products incorporate the alleged infringing RF ICs.


Read More

EMC Technology introduces temperature variable chip attenuator

EMC Technology has introduced another cost effective solution for temperature compensation in an SMT planar style, the AN11 series. This ultra mini Thermopad® offers the smallest 0402 package size for temperature variable attenuators in the industry. The AN11 series is perfect for hand held devices and instruments, pico base stations and more. With excellent frequency response from DC to 6 GHz the AN11 series handles 100mW of input power, requires no bias or control voltages and generates zero distortion.


Read More

UltraSource Inc. releases new thin film microcircuit CopperVia

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.


Read More