RF & Microwave Industry News

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French defense procurement agency, Direction Générale de l'Armement (DGA) has awarded Thales Alenia Space a design contract to study military space communications capacity to be available by 2019.

Tahoe RF Semiconductor has achieved another first pass success with the delivery of a highly integrated specialty GPS Receiver IC with exceptional performance in a small 76-pin molded plastic QFN package.

Agilent Technologies Inc. announced a memorandum of understanding has been signed with the China Academy of Telecommunication Research (Telecommunication Metrology Center), or CATR (TMC). The two organizations have agreed to work together on TD-LTE MIMO over-the-air (OTA) test research.

PIN diodes are essential tools in the designer’s handbook. There are many resources that provide information about PIN diode characteristics and integration. However, practical information about selecting the proper PIN diode-based product for a specific application is extremely hard to find. Narda’s new PIN Diode Control Products Application Note was created to fill this void.

With today’s emphasis on superior performance in a smaller, lighter, more cost-effective package, why settle for yesterday’s chip and wire solutions? Narda Defense Technology Solutions has pioneered the development of high performance, densely packaged Integrated Microwave Assemblies and Sub-Systems in footprints previously considered unachievable.

The series of application-focused webcasts instruct to make precise RF and microwave measurements with the new FieldFox family of microwave analyzers. Test results are comparable to that of benchtop equipment in the lab as well as field installation and maintenance environments. Topics include techniques for precise interference measurements, cable and antenna measurements, calibration and alignment measurements, time domain measurements and precise power measurements.

State of the Art (SOTA) Inc., a leading manufacturer of military, space level  and high reliability chip resistors, introduces a new line of temperature variable attenuators (TVA) for both high reliability and commercial applications. They are available in a 1512 case size (.150" X .125" X .020") with single surface solderable or wire bondable terminations.

Rogers Corp. will be participating in the PCB West 2012 Conference & Exhibition in both the technical program and the exhibition floor. The PCB West 2012 Conference & Exhibition (www.pcbwest.com) features a three-day technical conference (September 25-27) and one-day exhibition hall (September 26). Rogers Corporation (www.rogerscorp.com) welcomes visitors to join them for the PCB West 2012 Conference & Exhibition to learn more about the practical use of its high performance PCB materials.

The U.S. Air Force has awarded Northrop Grumman a contract to demonstrate technologies for its Three-Dimensional Expeditionary Long-Range Radar (3DELRR) program.

Agilent Technologies Inc. announced it will demonstrate a 32-Gb/s bit error ratio tester at ECOC (Amsterdam RAI, Hall 1, Stand 712) in Amsterdam, Sept. 17-19.