RF & Microwave Industry News

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Fujitsu Semiconductor Europe(FSEU) and MSC Vertriebs GmbH have signed a pan-European distribution agreement.

The NGMN Board has welcomed the launch of the second LTE Patent Pool managed by SISVEL and combining the patent portfolios of another seven companies.

Cassidian has developed a new generation of transmit and receive modules which give the new Active Electronically Scanned Array (AESA) radars previously unattained performance, the company claims.

CTS Corp. announced the appointment of Kieran O'Sullivan to the position of president and chief executive officer effective January 7, 2013. Mr. O'Sullivan will succeed Vinod M. Khilnani, current chairman and CEO, who will remain on the board of directors of the corporation and continue to serve as executive chairman until the Annual Shareholders Meeting in 2013 and retire from CTS Corp. on December 31, 2013.

ABI Research forecasts that a total of 1.95 billion NFC-enabled devices will ship in 2017 — a combination of both handsets and CE Devices. The lion’s share of NFC enablement will continue to be focused in the handset market, although we are expecting a surge of NFC functionality included within CE devices, for simple pairing of devices, exchange of data, and online authentication functionality. In total, 395 million CE devices will ship in 2017, predominantly into media tablets, PC accessories, and gaming consoles.

The Lockheed Martin team developing the U.S. Air Force’s next generation Global Positioning System III satellites has completed thermal vacuum testing for the Navigation Payload Element (NPE) of the GPS III Non-Flight Satellite Testbed (GNST). 

TT electronics announced the expansion of its North American operations in Mexicali, Mexico with a new state-of-the-art production facility for the company’s portfolio of variable and passive components serving the defense, aerospace, medical, transportation, energy and industrial electronics markets.

Agilent Technologies Inc. announced that Frost & Sullivan recognized the company for significant customer-centric initiatives and leadership in Brazil’s electronic test and measurement market, presenting Agilent with the 2012 Brazilian Frost & Sullivan Award for Customer Service Leadership.

Ardent Concepts has announced the availability of a new, patented, high density termination assembly solution for true 40 Gbps/40 GHz coaxial-to-PCB transition. The Terminate-R™ from Ardent Concepts is a compression mount (solderless) connector designed to provide the lowest loss interface between multiple lanes of high speed digital channels on a PCB to another PCB or measurement instrumentation.

MagnaChip Semiconductor Corp. ("MagnaChip Semiconductor"), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs), today announced that MagnaChip has expanded production of Peregrine Semiconductor's STeP5 UltraCMOS® technology-based RFIC product line, including the most recent DuNE™ Digitally Tunable Capacitors (DTCs) for RF impedance tuning.