RF & Microwave Industry News

Report says LTE-TDD has a lower TCO than LTE-FDD

LTE-TDD will go mainstream in 2014, and it is not just about China Mobile’s recently announced commitment to spend $3.3 billion on rolling out 207,000 LTE-TDD base stations. In the US, Clearwire is anticipated to have rolled out 5,000 LTE-TDD base stations which will play a complementary role in Sprint’s overall LTE service plans. Around the world, there are 60 LTE-TDD deployments, of which 21 have commercially launched.


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Microsemi announces next-generation handheld people screening solution for security and loss prevention

Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced its next-generation, AllClear® handheld screener with enhanced metal detection capabilities for security and loss prevention applications. The enhanced AllClear screener now has an integrated metal detector that allows users to more accurately detect metallic objects, as well as ceramics, plastics, liquids, gels, powders and paper that may be concealed on a person’s body.


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Peregrine introduces industry's highest isolation, carrier-grade Wi-Fi switch

Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs),  announced the highest performance, carrier-grade Wi-Fi switch on the market. With the highest isolation by a factor of 50, Peregrine’s switch also sets a new bar in linearity, which makes it ideally suited for the fast-growing market of 802.11ac Wi-Fi access points.


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MACOM introduces industry’s first surface mount L-Band 90W GaN power module

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, today announced the newest entry in its portfolio of GaN in Plastic packaged power products. Optimized for L-Band commercial air traffic control, military radar, and long range perimeter monitoring applications at 1.2 to 1.4 GHz, MACOM’s new 2-stage, fully matched GaN in Plastic power module scales to peak pulse power levels of 100W in a 14 x 24 mm package size – delivering twice the power of comparably sized competing products.


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Xilinx and Analog Devices achieve JEDEC JESD204B interoperability

Xilinx Inc. and Analog Devices Inc. announced that they have achieved JESD204B interoperability between Xilinx JESD204 LogiCORE™ IP in the Kintex®-7 FPGA and the ADI AD9250 analog-to-digital high-speed data converter. Achieving JESD204B interoperability between logic and data converter devices is a significant milestone in promoting the widespread adoption of this new technology.


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