RF & Microwave Industry News

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As high data rate applications put more strain on LTE wireless networks, innovative solutions such as small cell base stations (BTS) and carrier aggregation will be needed to bridge the bandwidth gap in high traffic areas. In response to broader bandwidth demand, Cree, Inc. introduces a family of GaN HEMT RF transistors that delivers industry-leading bandwidth and high efficiency performance to support today’s busy LTE networks.

NTT Docomo, Japan's biggest mobile operator, announced it is working with six suppliers to conduct various “experimental trials” for 5G involving higher frequency bands than those used for existing mobile technologies.

Chinese telecommunications giant Huawei is developing a 5G mobile network that aims to be a thousand times more powerful than current 4G technology and which can transfer up to 10 gigabytes per second, reports the Chinese-language Economic Observer.

 Altium Limited, a global leader in Smart System Design Automation, 3D PCB design (Altium Designer) and embedded software development (TASKING) has announced that it intends to begin a corporate reorganization to best serve the needs of their customers and partners in key growth markets.

Advantech Wireless Inc., a privately-held Canadian corporation and manufacturer of satellite, RF equipment and microwave systems announced that it has successfully completed the delivery of the New SapphireBlu^TM Series 6.6kW X-Band Rackmount UltraLinear^TM GaN SSPA/BUC, the ultimate solution for wide bandwidth, ultra high power satellite teleport uplinks.

Auriga announced that Agilent Technologies Inc. has designated Auriga Microwave a Global Solutions Partner, Agilent's highest level status for their Solution Partner program.

Cornell Dubilier Electronics Inc. (CDE) announced it has expanded its line of MLS flatpack aluminum electrolytic capacitors to include a high vibration package, type HVMLS and a high reliability burn-in option, type HRMLS.

Agilent Technologies Inc. announced a series of enhancements for its MXA and EXA X-Series signal analyzers. The enhancements are ideal for engineers performing wireless communications and general-purpose testing at various phases of the product life cycle, from R&D and design verification to manufacturing and installation.

Remtec Inc., the leading manufacturer of substrates and packages using plated copper on thick film (PCTF) metallization, has adapted its gold-tin plating technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and microwave electronic components, lead frames and other miniature parts on high frequency PC boards.

Indium Corp. technology experts will present at PCIM Europe May 20–22 in Nuremberg, Germany