RF & Microwave Industry News

RSS

Agilent Technologies Inc. announced that its EXM wireless test set now supports 4x4 True MIMO capability for WLAN design and validation, with up to four TRXs testing multiple-input, multiple-output antenna characteristics simultaneously. This capability further advances the gigabit era for WLAN evolution, especially the rapidly evolving 802.11ac technology.

This high resolution EMC/EMI diagnostic system has been reinvented to assist high density board designers to visualize the root causes of potential EMC and EMI problems during pre- and post-EMC compliance testing.

Molex Inc. announced that it will exhibit at the IEEE 2014 International Microwave Symposium (IMS) in Tampa Bay, FL June 1-6.  Molex will showcase its broad range of products and solutions available for the RF/microwave market in Booth 508.

Transline Technology, a US manufacturer of PCB fabrication services, announces the expansion of its west coast operations.  Alex Cox, the company's newest local sales engineer, will lead this effort from his San Francisco bay area office.

 

Avago Technologies and LSI Corp. announced that Avago has completed its acquisition of LSI Corp. for $11.15 per share in an all-cash transaction valued at approximately $6.6 billion. The acquisition creates a highly diversified semiconductor market leader with approximately $5 billion in projected annual revenues.

Anokiwave Inc., a supplier of semiconductors enabling mmW markets, announced the opening of its newest design center located in Billerica, MA to support the company's increasing demand for highly integrated SiGe core chips and GaAs/GaN front-end solutions.

 

The Internet of Things is an emerging theme in the technical sessionsat the IEEE MTT-S 2014 International Microwave Symposium (IMS), reflecting the critical part the microwave and RF industry plays in developing technologies that enable sophisticated peer-to-peer, machine-to-machine and people-to-machine scenarios.

Rogers Corp. and representatives of the company’s Advanced Circuit Materials division (ACM) will be present at the 2014 IEEE International Microwave Symposium (IMS) June 3-5 to help attendees learn more about Rogers' wide range of high frequency circuit materials.

Emerson announced that it has agreed to divest its connectivity solutions business unit to Bel Fuse Inc.  The transaction, valued at $98 million, is expected to close before the end of the fiscal year, with proceeds deployed for incremental share repurchase in 2014.

CTS Corp., through its subsidiary, CTS Electronic Components Inc., continues to deliver outstanding products that meet more industry’s needs by offering clock and voltage control oscillators with high performances and great values. The company will be unveiling these new devices on June 3-5, 2014 at the IEEE International Microwave Symposium (IMS) in Tampa, FL at booth number 322.