RF & Microwave Industry News

Analog Devices unveils 2.5-GSPS A/D converter, driver amplifier and rapid prototyping FMC module

Analog Devices Inc. announced immediate availability of the AD-FMCADC2-EBZ FMC module with HDL code and software drivers for rapid design prototyping and interoperability with Xilinx FPGAs. The AD-FMCADC2-EBZ board incorporates the 12-bit, 2.5-GSPS AD9625-2.5 A/D converter and the ADA4961 RF amplifier, also introduced today, with input balun, power supplies and software stack.


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Skyworks introduced suite of breakthrough ultra low noise amplifiers at MTT-S 2014

Skyworks Solutions Inc., an innovator of high performance analog semiconductors enabling a broad range of end markets, unveiled a suite of new, ultra-low noise amplifiers (LNAs) for cellular infrastructure, wireless connectivity and broadcast communication applications.  The new LNAs provide best-in-class noise figure as well as high gain and linearity, improving receiver sensitivity and dynamic range.


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T-Tech Inc. & The Geek Group partner to provide PCB design/prototyping

T-Tech Inc. and The Geek Group announced a joint agreement to offer a state of the art solution and facility for rapid printed circuit board (PCB) design, verification, and fabrication. The collaboration will combine T-Tech's QCJ5 series Quick Circuit System and IsoPro® Software for PCB prototyping with The Geek Group's expertise and 43,000 square foot Leonard Street Labs Facility in Grand Rapids, Michigan.


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Soitec and Simgui announce major partnership to produce 200-mm SOI wafers in China

Soitec, a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, and Shanghai Simgui Technology Co. Ltd., a Chinese silicon-based semiconductor materials company, have formed an international partnership to address both China's growing demand and limited worldwide production capacity for 200-mm silicon-on-insulator (SOI) wafers used in fabricating semiconductors for radio-frequency (RF) and power applications.


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RFS enhances DAS portfolio with low PIM directional couplers & power dividers

Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, announces the availability of new models of its low PIM directional couplers and power dividers. Designed to support in-building and in-tunnel wireless applications using DAS systems, the latest products from RFS provide a cost-effective way to divide and distribute power as needed.


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CTS new small size OCXO brings huge benefits to telecommunications and wireless applications

CTS Corporation, through its subsidiary, CTS Electronic Components, Inc., announces its new Model 149, a small size oven-controlled crystal oscillator (OCXO), that operates at temperatures suitable for commercial and industrial use. CTS introduced the new precision OCXO along with the company’s other cutting-edge offerings at the IEEE International Microwave Symposium (IMS) in Tampa, Fla., June 3-5 at booth number 322.


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Vectron International announces small form factor low G-sensitivity TCXO

Vectron International, a leader in the design and manufacture of precision oscillators and timing solutions for communication, industrial, military & space applications, announced the release of a low g-sensitivity TCXO for military, industrial and other harsh environment applications. This product will be showcased in Booth 1305 at the IMS 2014 Symposium in Tampa, FL from June 3-5th 2014.


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