RF & Microwave Industry News

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 5G:haus recently completed a world first field trial of self-interference cancellation (SIC) technology together with Kumu Networks. SIC is a potential 5G technology that allows in-band full duplex communication. In other words, it solves the challenge of simultaneously transmitting and receiving signals at the same time and on the same frequency, thus significantly enhancing the spectral efficiency. 

Alcatel-Lucent has provided TIM (Telecom Italia Group's unique brand) with a microwave link that will ensure continuous ultra-broadband connectivity between the Sicilian islands of Pantelleria and Lampedusa.

Anite announced that the UK’s University of Bristol has selected the company’s Propsim F8 Channel Emulator for its 5G research projects.

7layers has opened a further, extensive EMC laboratory in Beijing that features a 10 m semi-anechoic chamber and a 3 m fully anechoic chamber plus further shielded rooms and control rooms.

Qorvo Inc., a leading provider of core technologies and RF solutions for mobile, infrastructure and aerospace/defense applications, announced it will showcase its extensive portfolio of DOCSIS 3.1 products at the upcoming SCTE 2015 Cable-Tec Expo in New Orleans.

M/A-COM Technology Solutions Inc., a leading supplier of high-performance analog RF, microwave and optical semiconductor products, announced the new MAXP-37161, a highly integrated, low power, fully non-blocking 16 channel 28 Gbps crosspoint switch targeted for 100G Ethernet, EDR InfiniBand and OTN applications.

Modelithics Inc., a leading RF/microwave simulation model provider, announces a new partnership with Vishay, one of the world’s largest manufacturers of discrete semiconductors and passive electronic components.

Verizon and Intel announced that the companies are working together to accelerate the development of the next-generation wireless technology, commonly known as 5G.

The SX probe heads' high measurement resolution allows the developer to pinpoint RF sources of between 1 and 10 GHz on densely packed printed circuit boards or on IC pins. The handy compact pin shape of the EMC near-field probes from Langer EMV-Technik GmbH provides the developer with convenient working conditions on the respective PCB.