RF & Microwave Industry News

Anritsu expands waveguide mixer series to support mmWave measurement

Anritsu Corp. released its new high performance waveguide mixer MA2806A to expand millimeter wave measurement solutions. Connecting the new MA2806A to Anritsu’s signal analyzer MS2830A supports spectrum measurements in the 50  to 75 GHz Band (V-Band) currently used by various millimeter wave sensors, WiGig Gigabit Wireless LAN (802.11ad), and broadcast video camera streaming equipment.


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Smart Equipment Technology (SET) joins IRT Nanoelec 3D integration program

Smart Equipment Technology (SET), a leading supplier in high accuracy die-to-die and die-to-wafer bonders, announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies, using direct copper-to-copper bonding.


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Keysight Technologies announces the Keysight Distinguished University program

Keysight Technologies Inc. introduced the Keysight Distinguished University Program; a program designed to identify and acknowledge educational excellence in creating industry-ready engineers. The program provides a strong level of cooperation and support between each participating University and Keysight. The program also creates a process to engage students in industry-related projects based on the latest technologies.


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Qualcomm and TDK form joint venture to provide RF front-end solutions for mobile devices

Qualcomm Inc. and TDK Corp. announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore PTE. Ltd.


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RJR Polymers changes name to RJR Technologies

RJR Polymers, a leading developer of high performance liquid crystal polymer (LCP) Air Cavity semiconductor packaging (ACP), announced that it has changed its name to RJR Technologies Inc. The new name reflects the company’s growing role as a leading developer and high volume manufacturer of high performance LCP Air Cavity plastic packaging for RF and microwave applications. The company will begin operating under its new name and form a new website, www.rjrtechnologies.com, immediately.


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