RF & Microwave Industry News

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Skyworks Solutions, Inc., an innovator of high performance analog semiconductors connecting people, places and things, launched SkyBlue™, a new and revolutionary enabling technology that enhances both the power capability and efficiency in LTE amplifiers and front-end solutions. Designs utilizing SkyBlue™ technology not only deliver twice the power of envelope and average power tracking systems available on the market today, but across much broader power ranges. 

NXP Semiconductors N.V., a worldwide leader in the cellular infrastructure market, announced the strategic alignment following the merger of NXP and Freescale of comprehensive products and technologies to meet the complete system challenges of 5G. NXP’s comprehensive portfolio of low and high power RF technologies are being combined to address 5G demands of bandwidth, linearity, power-efficiency and small form factor solutions.

Qorvo® Inc., a leading provider of core technologies and RF solutions for mobile, infrastructure and defense applications, announced Qorvo has joined 3GPP™ as a guest delegate to assist in the development of key aspects of 5G next-generation wireless communications standards.

Fairview Microwave Inc., a supplier of on-demand microwave and RF components, debuts a new family of semi-rigid test probes operating up to 6 GHz. Designed to assist in testing microwave circuits, these test probes are constructed of high quality semi-rigid coax and SMA female connectors.

NXP Semiconductors has introduced the MMZ25332B4 InGaP HBT linear amplifier, particularly for where thermal sensitivity is high.

Keysight Technologies, Inc. announced it will demonstrate the industry’s first integrated, millimeter wave design validation and manufacturing solution for 802.11ad standard at Mobile World Congress, Hall 1, Booth 1E10, Fira Gran Via, Barcelona, Feb. 22-25.

Soitec (Euronext), a world leader in manufacturing innovative semiconductor materials and a supplier of wafers for radio-frequency silicon-on-insulator (RF-SOI) applications, has begun mass production of 300-mm RF-SOI substrates for mobile communications.

The latest report published by the GSA confirms accelerating growth of the LTE ecosystem and expansion in the availability and performance of LTE-Advanced devices.

The Microwave Vision Group (MVG) and Amplifier Research (AR) have teamed up to present their combined EMC TurnKey Solutions at EMV in Düsseldorf, Germany from 23 to 25 February.

Filtronic has received an order to develop core elements within long range, E-Band communication systems from a major U.S. multinational company.