RF & Microwave Industry News

Dr. Eli Brookner to Keynote Radar Conference and Present Tutorial at EDI CON China

BrooknerEDI CON China 2016 is pleased to announce Dr. Eli Brookner’s participation as a keynote speaker and course instructor covering advancements in radar and phased array technology. Dr. Brookner will provide a keynote speech at the China Radar Industry Association conference that is co-located with EDI CON China 2016 and will also teach a two-hour course as part of the EDI CON 2016 conference.


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Linear Technology expands in Singapore to boost worldwide production capacity

Linear Technology Corp. opened the company’s third semiconductor test facility in Singapore. The additional space for staff, equipment and materials will allow the company to more than double its production capacity of advanced analog circuits and µModule® (micromodule) products. This will strengthen Linear Technology’s ability to meet the growing demand for high performance analog integrated circuits worldwide.


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Romania increases inventory of LM radars

Romania will gain greater situational awareness with two new TPS-77 radars under a contract agreement with Lockheed Martin. Like all next-generation radars made by Lockheed Martin, the company is planning to include innovative new Digital Array Row Transceivers (DART), which lead to energy efficiency and greater performance for the Lockheed Martin suite of radars.


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NXP and Nokia’s Bell Labs demo converged 5G wireless and wireline access technology

NXP Semiconductors™ N.V., a worldwide leader in advanced systems solutions for the world’s new virtualized networks, and Bell Labs, the industrial research division of Nokia, announced they are the first to create and demonstrate a universal access device that can be used to combine wireline and wireless access support. The device is capable of supporting wireline (cable, DSL/copper) and wireless (LTE, 5G) standards with a single modem.


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Keysight's latest release of semiconductor device modeling and characterization software

Keysight Technologies Inc. announced the newest release of its industry-leading device modeling and characterization software suite: Integrated Circuits Characterization and Analysis Program (IC-CAP) 2016, Model Builder Program (MBP) 2016, and Model Quality Assurance (MQA) 2016. The software release provides designers characterizing and modeling semiconductor devices with further advances in modeling and characterization efficiency.


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