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Emerson and NI announced that they have entered into a definitive agreement under which Emerson will acquire NI for $60 per share in cash at an equity value of $8.2 billion.
Passive Plus (PPI)has expanded its broadband capacitor line to include the industry’s smallest .010”x.005” broadband part characterized for RF performance.
Molex has extended its cable assembly product line with the addition of innovative solutions from I-PEX to offer I-PEX MHF® 4L LK and MHF® I LK cable assemblies.
OnGo Alliance announced the winners for the OnGo Alliance 2022 Awards that recognize innovations in real-world CBRS solutions and their business impact.
Northrop Grumman Corporation’s AN/ALQ-257 Integrated Viper Electronic Warfare Suite (IVEWS) has completed U.S. Air Force Laboratory Intelligence Validated Emulator (LIVE) testing.
MAPCON-2023, from December 10-14, 2023, invites authors to submit technical papers, from May 15, 2023, to July 31, 2023, of 3-4 pages in length describing their original research work.
Indium Corporation® has released a new, bismuth-based, low temperature alloy developed for low temperature reflow processes which require enhanced thermal cycling reliability.
New plans and investment to boost digital connectivity and put the U.K. at the forefront of future telecoms technologies have been unveiled by Technology Secretary Michelle Donelan – unlocking growth, innovation and potential across the country.
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