We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
Smiths Interconnect, a division of Smiths Group plc, announced it is unifying its technology brands of EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and TRAK under the single brand identity of ‘Smiths Interconnect’.
Indium Corp.has named Jim Hisert as Indium Applications Manager. Hisert is responsible for exploring and leveraging the use of indium in various forms and applications. He will use this information to identify new markets for existing products and identify new opportunities.
MaxLinear announced a baseband system on chip (SoC) for broadband wireless transmission systems. The MxL85110 is a full duplex, single carrier, FDD modem that provides a comprehensive processing chain from the various user IP interfaces to the analog baseband signals, including analog-to-digital and digital-to-analog converters.
Qorvo added three new solid-state power amplifier (SSPA) modules to the company's Spatium amplifier family: a 300 W SSPA covering 2 to 6 GHz, a 150 W SSPA covering 2 to 8 GHz and a 60 W unit covering 2 to 18 GHz.
Qorvo announced two dual-channel switch-LNA modules for base stations, covering 2.3 to 2.7 GHz and 1.8 to 4.2 GHz, respectively. Designed for TDD massive MIMO architectures, each channel integrates a T/R switch to connect the antenna to a two-stage LNA in receive mode or, in transmit, passes the signal from the PA to the antenna.
TowerJazz and The University of California, San Diego (UCSD) demonstrated >12 Gbps from a 5G phased-array chipset operating from 28 to 31 GHz. The chipset was fabricated with the TowerJazz H3 SiGe BiCMOS process.
RSS
