RF & Microwave Industry News

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Dow-Key^® Microwave will be displaying the Reliant Switch™ Product Series, Miniature MS-Series Matrix (MMS) and Next Generation Waveguide Switch products at IEEE MTT-S International Microwave Symposium (IMS), Booth 1639, in San Francisco, Calif., May 24-26 at the prominent Moscone Center.

RFMW Ltd. announces participation at the IEEE IMS2016 symposium to be held in San Francisco, Calif. May 24-26. International Microwave Symposium (IMS) is the premier conference and exhibition for RF design engineers to learn about the latest topics and new products important to the RF and microwave industry.

Global connectivity leader HUBER+SUHNER continues to establish its expertise at the International Microwave Symposium in San Francisco, 22-27 May 2016, exhibiting a range of new products including SUCOFLEX 500V VNA test assemblies, Microbend L, SUCOFLEX 126 and its RF/GPS/LAN-over-Fiber Series, which combine radio frequency and fiber optics in one system.

Richardson RFPD Inc. announces its attendance and participation at the 2016 IEEE MTT International Microwave Symposium (IMS), the premiere international gathering for all aspects of microwave theory and practice. The IMS2016 is the largest RF/Microwave commercial exhibition in the world, with more than 600 exhibiting companies. It is held in conjunction with the IEEE RFIC and ARFTG conferences.

Sheppard Leger Nowak Inc. and Microwave Journal have teamed up again on Passport to IMS, their annual show promotion to take place during the upcoming International Microwave Symposium event in San Francisco May 24-26, 2016.

Vaunix Technology Corp., a manufacturer of USB controlled and powered test equipment, will be debuting two new test application solutions at the 2016 International Microwave Symposium (IMS) in San Francisco, Calif., the LDA-203 and the LMS-802DX.

Rogers Corp. is pleased to introduce 92ML™ materials. These thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. 92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics. These materials are ideal for multilayer applications requiring thermal management throughout the entire board.

Ampleon announced the availability of the BLCU188XRS, a 1400W, CW capable, high power extremely rugged transistor constructed in a thermally optimized air cavity ACP3 copper flanged plastic package. Able to withstand extremely load mismatches, up to a VSWR > 65:1, this Gen6 HV 50 V LDMOS device has a 30 percent better thermal resistance (R,th) compared to a traditional air cavity ceramic packaged transistor, and combined with its high efficiency, requires less stringent cooling requirements.

Responding to strong demand for energy-and-cost efficient Internet of Things (IoT) connectivity in the U.S., SIGFOX, the world’s leading provider of dedicated IoT connectivity, announced it will expand deployment of its network in 100 cities across the country in 2016.

While 5G research continues at a rapid pace to develop very high-speed, low latency networks, the IoT market has opposite needs for a relatively low data rate, very low power network that can support millions of devices and sensors. How can these be reconciled or do we need to develop separate networks? How do the current 3G/ 4G networks and possible discontinuation of 2G play into the picture? How about WiFi and some of the newly developed low power wide area network concepts? This panel of experts will debate possible solutions, how they affect the wireless market and possible future directions.