RF & Microwave Industry News

RSS

Eclipse Global Connectivity, ThinKom, Kontron and Display Interactive have embarked on an innovative collaboration to retrofit a fleet of more than 50 narrow-body aircraft with the ultimate high speed connectivity.

The matching pads feature BNC, F-type, N-type and SMA connectorized designs, making them versatile for integrating into existing systems with ease. The pads facilitate 50 Ohm to 75 Ohm impedance.

According to a study published in Nature, an international team of researchers from Rice University and Hanyang University developed a new material by embedding clusters of highly dielectric ceramic nanoparticles into an elastic polymer.

Celestia TTi's new generation of GaN solid-state power amplifiers (SSPAs) in DBS can deliver up to 54.8 dBm/57.4 dBm/52 dBm at P LINEAR from a highly compact footprint.

To continue to provide critical infrastructure operators with a secure timing solution, Microchip Technology announces the release of version 2.4 of the TimeProvider® 4100 grandmaster firmware with an embedded BlueSky™ firewall function to detect potential threats and validate GNSS before using the signal as a time reference.

IDTechEx’s report, “Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets,” delves into key considerations such as antenna element choice, substrate technology, integration of passive devices and supply chain maturity.

KRYTAR, Inc. announces a new MLDD 2-way power divider offering excellent performance over the frequency range of 0.4 to 7.125 GHz (L- through C-Bands) in a compact package.