RF & Microwave Industry News

NI and Astronics introduce new PXI instruments for Aerospace and Defense

NI and Astronics Test Systems Inc., (ATS) a wholly-owned subsidiary of Astronics Corp. announced the Astronics PXIe-6943 Digital Test Instrument, Astronics PXIe-3352 Rubidium Clock Source and Astronics PXIe-1209 Pulse Pattern Generator. The three new test instruments accompany the previously released Astronics PXIe-2461 Frequency Time Interval Counter and are the latest products from NI and Astronics’ collaboration to provide PXI-based instruments with test program set-(TPS-) compatible software for existing VXI instruments.


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NI AWR software featured in RF/Microwave power amplifier forum at EuMW 2016

NI AWR Design Environment will be featured in the third annual NI-sponsored RF/Microwave Power Amplifier Forum being held during European Microwave Week (EuMW 2016), October 4-6 in London. Entitled Device Technologies, Characterization, Modeling and End-Use Applications, the forum takes place on Wednesday, October 5 from 9:30 a.m. to 2:00 p.m. in Room 6, Conference Area Level 3.


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e2v and Peregrine Semiconductor introduce new ultra-low phase noise PLL

e2v, a global leader in the high-reliability semiconductor market, and Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, introduce the PE97640, an ultra-low phase noise FRAC-N phase-locked loop (PLL) for commercial space applications. Available exclusively through e2v, the PE97640 is the first new space product since e2v and Peregrine signed a strategic reseller agreement in February. Built on Peregrine’s radiation-tolerant UltraCMOS® technology, the PE97640 will be manufactured and qualified by e2v.


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ANSYS AIM 17.2: Expanding upfront simulation for the design engineer

With the latest release of ANSYS AIM, organizations can accelerate product design through upfront simulation, mitigate late-stage design changes, and reduce the number of costly physical prototypes. Now available, ANSYS AIM 17.2 enhances engineering simulation for thermal management, extends collaboration between designers and analysts, and brings upfront simulation to Japanese engineers in their own language.


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