RF & Microwave Industry News

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Telewave, Inc. introduced the M108-150-XTP-M Series transmitter combiners that deliver very high isolation, low loss and high RF power handling capability for use in public safety and land mobile radio applications operating between 148 to 174 MHz.

Pure-play foundry TowerJazz has announced a silicon photonic process (SiPho) developed for optical networking applications. The process includes several versions of single-mode silicon waveguides, high speed germanium photodetectors, p-n junction modulators and compatibility with edge and grating couplers.

Pentek, Inc. introduced the newest member of the Jade™ family of data converter XMC modules. The Model 71851 is based on the Xilinx Kintex Ultrascale FPGA and features two 500 MHz, 12-bit A/Ds with multiband digital down converters (DDCs), one digital upconverter (DUC) and two 800 MHz 16-bit D/As.

Integrated Device Technology, Inc. (IDT) announced the appointment of Chris Allexandre as its new senior vice president of global sales and marketing. A sales veteran with more than 20 years in the semiconductor industry, Allexandre’s experience covers analog mixed signal products in the mobile, industrial, telecom, cloud, consumer and automotive markets.

Ericsson and SoftBank Corp. will evaluate the performance of 28 GHz links, indoor and outdoor, stationary and mobile. The trials will test the performance of massive MIMO, massive beamforming, distributed MIMO, multi-user MIMO and beam tracking and how each supports the requirements of 5G.

MaxLinear Inc. announced a 64 GBd linear coherent transimpedance amplifier (TIA) for 400 and 600 Gbps dense wave division multiplexing (DWDM) coherent systems. The MxL9162 exceeds the performance requirements of 64 GBd high bandwidth micro-intradyne coherent receiver designs for long-haul, metro and data center interconnect applications.

MACOM announced three surface-mount 64 GBd linear modulator drivers for 600G coherent optical networks. With differential inputs and single-ended outputs for use with InP and LiNbO₃ modulators, the drivers support 64 GBd and 64-QAM modulation.