RF & Microwave Industry News

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Huber+Suhner reports a significant increase in order intake after nine months of 2014, with a rise in net sales in organic terms.

Teledyne LeCroy introduces the LabMaster 10-100Zi, 100 GHz oscilloscope, a technology key to analyzing and understanding the phenomena found in R&D labs where engineers and scientists are working on next-generation communication systems, high bandwidth electrical components and fundamental scientific research.

Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announced its third quarter 2014 financial results. 

Keysight Technologies, Inc. announced it will demonstrate an innovative and diverse range of electronic test solutions at electronica 2014, Nov. 11 – 14, Munich, Hall A1, Booth 506. 

High Speed Interconnects, an extruder and manufacturer of high-performance coaxial cable and coaxial cable assemblies, has announced a range of armored cables that display excellent compression resistance after crush forces in excess of 300 lbs. per square inch. 

Element Six, an industry leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130. 

Intel and IBM will present dueling approaches to the development of FinFET technology for the 14 nm technology node in two late-news papers to be given at this year's IEEE International Electron Devices Meeting (IEDM), December 15-17, 2014 in San Francisco, Calif.

Southwest Microwave, Inc., a leading global supplier of high performance microwave connectors, has announced the introduction of a new line of 1.0 mm (W) DC to 110 GHz connectors. Products in this high-frequency connector series include field-replaceable two and four-holeflange mount and thread-in connectors, direct solder cable connectors, and clamp-on end launch connectors, including low profile and reduced-size low-profile versions.

Texas Instruments Inc. announced the election of Haviv Ilan to senior vice president of High Performance Analog (HPA), succeeding Steve Anderson, who will now lead TI Analog overall. Ilan is responsible for managing an extensive portfolio of amplifiers, data converters and interface products, as well as medical and high-reliability products. 

The K701 digital receiver from Innovative Integration supports one or two plug-in FMC modules each providing up to eight independent channels of DDC and one spectrum analyzer embedded in a Xilinx Kintex-7 FPGA.