The role of laser technology in the manufacturing of electronic components and products continues to grow. For instance, more than 20 different laser processes are used in the production of smartphones, such as for structuring thin layers, for producing three-dimensional conductor structures on plastic bodies, and for cutting glass and printed circuit boards. For these applications, the importance of short-pulse and ultrashort-pulse lasers is continually rising. The joint project “(U)SP Laser Beam Sources for Industrial Use and System-wide Productivity Improvement for Highly Dynamic Drilling and Cutting Applications” (InBUS) focuses on increasing efficiency, available output power, and flexibility of these laser sources.