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The Biden-Harris Administration announced that the U.S. Department of Commerce and GlobalWafers America, LLC and MEMC LLC, subsidiaries of GlobalWafers Co., Ltd. have signed a non-binding PMT to provide up to $400 million in proposed direct funding under the CHIPS and Science Act.
The Biden-Harris Administration announced that the U.S. Department of Commerce and Amkor Technology, Inc. have signed a non-binding PMT to provide up to $400 million in proposed direct funding under the CHIPS and Science Act.
stc Group and Ericsson have achieved a groundbreaking milestone, deploying the world's first implementation of automated radio resource partitioning (RRP) on a 5G standalone network slice.
Falcomm has sought to provide the next big leap in technology that will drastically improve energy efficiency over the state of the art. As part of their efforts, Falcomm has released their first power amplifier product, the FCM1401.
ATIS’ Next G Alliance published "Channel Measurements and Modeling for Joint/Integrated Communication and Sensing," as well as "7-24 GHz Communication," a study of 6G communication channels and JCAS/ISAC channel models.
The European Space Agency's (ESA’s) Hera mission for planetary defence involves not just one spacecraft but three: two shoebox-sized CubeSats will fly up to a few dozen kilometres away from their mothership around the Didymos binary asteroid system.
Modelithics, Inc. announced the release of version 24.5.4 of the Modelithics Qorvo GaN Library for use with Keysight Technologies’ Advanced Design System (ADS) and Cadence AWR Design Environment®.
Teledyne e2v HiRel announced the availability of two enhanced plastic (EP) VHF to S-Band low noise amplifiers, models TDLNA2050EP and TDLNA0430EP which are ideal for use in demanding high-reliability applications.
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