RF & Microwave Industry News

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Skyworks Solutions, Inc. released its 2016 Sustainability Report, a voluntary public document that provides a comprehensive self-assessment of the company’s commitment to sustainable business practices.

Accumet Engineering announced the growth and success achieved by Accumet’s new management.

W. L. Gore & Associates (Gore) will be featuring the new GORE® PHASEFLEX® RF/Microwave Test Assemblies, Type 0N for High Density Test/Interconnection at EDICON China 2017 in Shanghai on April 25-27 at booth number 319.

Tektronix, Inc. introduced the TTR500 Series USB vector network analyzer (VNA), adding to the growing Tektronix portfolio of USB-based RF test instruments.

Rosenberger has launched the High-Power Super Speed Data (HPD^®) series – a universal applicable multicore datalink connection system for high data rate transmission.

Manufacturers who want to integrate wireless modules into their products now face completely new test requirements. The US's largest wireless network operator is the first to publish specific test plans for IoT integrators. In response, Rohde & Schwarz announces the availability of its new R&S TS 290 IoT carrier acceptance test system, which is based on these test plans. Claimed to be the only test solution of its kind, it offers RF, protocol and performance test cases in a single box.