RF & Microwave Industry News

AR introduces new board of directors

AR has assembled a board of directors with a diverse group of professionals to help assure that the organization remains on its path of success well into the future. This group has varied expertise in the fields of finance, consulting, and manufacturing. Each member was chosen for the skills in their respective fields which will further the company's goals in this advisory capacity.


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NYU WIRELESS to make key 5G software free and open to all

In his keynote speech at a Federal Communications Commission workshop on 5G wireless technology, pioneering researcher Theodore (Ted) Rappaport announced that New York University is making its channel model simulator and measurement data free and open to all—potentially short-circuiting years of millimeter wave (mmWave) development time for companies hoping to vastly increase the transfer of data through the air.


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Teledyne LeCroy, Coherent Solutions, Anritsu and Oclaro showcase 400G test platform

Teledyne LeCroy, Coherent Solutions Ltd., Anritsu Co. and Oclaro Inc. announced a new joint effort to demonstrate the highest performance single-carrier 16 QAM signal generation and analysis capabilities available at 56 Gbaud. The demonstration of the partners’ latest optical communications test equipment platform takes place at OFC 2016 in Anaheim, Calif. in the Teledyne LeCroy Booth #1115.


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Mercury Systems receives $2.2M order for signals intelligence application

Mercury Systems Inc. announced that it received a $2.2 million order from a leading systems integrator to supply high-performance digital signal processing and radio frequency (RF) modules for a signals intelligence application. The order was booked in the Company’s fiscal 2016 third quarter and is expected to be shipped by the end of its fiscal 2016 fourth quarter.


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SemiGen Inc. launches new website

SemiGen Inc., an ISO and ITAR registered RF/microwave assembly, automated PCB manufacturing and RF Supply Center, has launched a new website. The site features updated RF/microwave testing/assembly/design, PCB assembly, semiconductor upscreening and RF/microwave module repair pages with detailed parameter and specification listings.


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