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Sheppard Leger Nowak Inc. and Microwave Journal have teamed up again on Passport to IMS, their annual show promotion to take place during the upcoming International Microwave Symposium event in San Francisco May 24-26, 2016.
Vaunix Technology Corp., a manufacturer of USB controlled and powered test equipment, will be debuting two new test application solutions at the 2016 International Microwave Symposium (IMS) in San Francisco, Calif., the LDA-203 and the LMS-802DX.
Rogers Corp. is pleased to introduce 92ML™ materials. These thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. 92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics. These materials are ideal for multilayer applications requiring thermal management throughout the entire board.
Ampleon announced the availability of the BLCU188XRS, a 1400W, CW capable, high power extremely rugged transistor constructed in a thermally optimized air cavity ACP3 copper flanged plastic package. Able to withstand extremely load mismatches, up to a VSWR > 65:1, this Gen6 HV 50 V LDMOS device has a 30 percent better thermal resistance (R,th) compared to a traditional air cavity ceramic packaged transistor, and combined with its high efficiency, requires less stringent cooling requirements.
Responding to strong demand for energy-and-cost efficient Internet of Things (IoT) connectivity in the U.S., SIGFOX, the world’s leading provider of dedicated IoT connectivity, announced it will expand deployment of its network in 100 cities across the country in 2016.
While 5G research continues at a rapid pace to develop very high-speed, low latency networks, the IoT market has opposite needs for a relatively low data rate, very low power network that can support millions of devices and sensors. How can these be reconciled or do we need to develop separate networks? How do the current 3G/ 4G networks and possible discontinuation of 2G play into the picture? How about WiFi and some of the newly developed low power wide area network concepts? This panel of experts will debate possible solutions, how they affect the wireless market and possible future directions.
Skyworks Solutions Inc., an innovator of high performance analog semiconductors connecting people, places and things, expanded its world-class mobile connectivity product portfolio with the addition of several new wireless networking solutions.
AEM, the industry’s high-reliability component solutions leader will be showcasing their high-reliability product lines at Space Tech Expo, May 24 – 26 in Pasadena, Calif., Booth 6008.
RJR Technologies, a leading developer of high performance Air Cavity Plastic (ACP) packaging, announced that it has shipped over 10 million ACP packages. As a high volume manufacturer of semiconductor packaging for RF and microwave markets, RJR’s milestone reflects the increasing use of plastic packages in high performance, high frequency RF applications.
According to a new report by ASDReports, the global small satellite market has been estimated to be worth $2.2 billion in 2016 and is projected to be valued at $5.3 billion by 2021, registering a CAGR of 19.14 percent during the forecast period.
RSS
Sheppard Leger Nowak Inc. and Microwave Journal have teamed up again on Passport to IMS, their annual show promotion to take place during the upcoming International Microwave Symposium event in San Francisco May 24-26, 2016.
Vaunix Technology Corp., a manufacturer of USB controlled and powered test equipment, will be debuting two new test application solutions at the 2016 International Microwave Symposium (IMS) in San Francisco, Calif., the LDA-203 and the LMS-802DX.
Rogers Corp. is pleased to introduce 92ML™ materials. These thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. 92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics. These materials are ideal for multilayer applications requiring thermal management throughout the entire board.
RJR Technologies, a leading developer of high performance Air Cavity Plastic (ACP) packaging, announced that it has shipped over 10 million ACP packages. As a high volume manufacturer of semiconductor packaging for RF and microwave markets, RJR’s milestone reflects the increasing use of plastic packages in high performance, high frequency RF applications.
According to a new report by ASDReports, the global small satellite market has been estimated to be worth $2.2 billion in 2016 and is projected to be valued at $5.3 billion by 2021, registering a CAGR of 19.14 percent during the forecast period.