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Stellant Systems, Inc. was one of two companies recently awarded a $91M IDIQ contract from the U.S. Navy to repair crossed field amplifiers for the AEGIS Combat System.
In a new partnership, Indium Corporation and SAFI-Tech will evaluate market applications for supercooled solder materials and explore the development of new products.
Mission Microwave Technologies, LLC confirmed an eight million dollar order for the continuation of a major upgrade program for a customer supporting a U.S. government requirement.
SPARK Microsystems and UWB Alliance have initiated a joint effort to test the coexistence and aggregation capabilities of UWB technology in environments where other UWB or other wireless protocols and radio devices are in use.
nScrypt’s research arm, Sciperio, has received US Patent no. 10,966,312, entitled “Printed Litz Line,” which has two independent claims and 12 dependent claims and covers a method of 3D printing a litz line.
The 68th annual IEEE International Electron Devices Meeting (IEDM), the leading forum for the unveiling of breakthroughs in transistors and related micro/nano technologies, will be held December 3-7, 2022 in San Francisco.
Keysight Technologies, Inc. is first to enable laptop vendors to verify Arm-based 5G PCs powered by Windows on Snapdragon® Compute Platforms with integrated software-centric test solutions.
ATIS’ Next G Alliance released recommendations forecasting the technologies that will be needed to advance the 6G future and areas in which further research is required on North American 6G priorities, presented in "Next G Alliance Report: 6G Technologies."
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