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Soitec announced the continuation of its research collaboration with the Microsystems Technology Laboratories (MTL) of the Massachusetts Institute of Technology (MIT), further solidifying its presence in the North American semiconductor sector.
Anritsu and Bluetest have combined their recent product upgrades to create an OTA measurement solution in a MIMO environment for verification of RF performance in the tri-frequency bands of the latest WLAN Wi-Fi 7 standard (IEEE 802.11be).
Qualcomm Incorporated announced the appointment of Dr. Baaziz Achour to the role of chief technology officer (CTO), Qualcomm Technologies, Inc., and the retirement of Dr. James Thompson, each effective February 3, 2025.
Mercury Systems, Inc. introduced a system on module (SoM) and 3U SOSA-aligned OpenVPX board powered by Altera’s™ most advanced Agilex 9 Direct RF FPGA chips.
With its new R&S NRPxE RF power sensors, Rohde & Schwarz sets a new standard for accurate and reliable power measurements in frequency ranges up to 18 GHz.
NXP Semiconductors announced that its continued strategic collaboration with geo to leverage geo's deep experience in energy management and NXP's intelligent system solutions for Matter.
Teledyne e2v announced engineering models of the LX2160-Space 16-core Arm® Cortex® A72 based system on chip (SoC) processor, enabling early project design, hardware and software validation for space-demanding applications.
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