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Keysight Technologies, Inc. announced it has collaborated with Qualcomm Technologies, Inc. to establish an end-to-end 5G non-terrestrial network (NTN) connection with aim to accelerate 5G NTN technology to provide affordable broadband connectivity in remote areas.
Akoustis’ acquisition of GDSI is expected to support a strategy to reshore its packaging of XBAW filters to the United States and to support its anticipated application for funding under the CHIPS and Science Act.
Morse Micro announced a partnership with AzureWave Technologies, Inc. where the partnership sees AzureWave design and manufacture two Wi-Fi HaLow modules, including a new 13 x 13 mm module, the smallest in the market.
CES 2023 marks KYOCERA AVX’s first year of participation at this legendary industry event, which will consist of a main exhibition at booth #11123, a co-exhibit at the KYOCERA SLD Laser booth (#7075) and a panel discussion in partnership with the IMC IoT M2M Council.
Akoustis Technologies, Inc. announced that it has completed qualification and released its internally developed proprietary wafer-level-packaging (WLP) technology for the 5G mobile, Wi-Fi, timing control and other markets.
Indium Corporation® has added to its portfolio of pastes for fine feature printing with a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components.
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