RF & Microwave Industry News

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Averna announces a new software release for RF Studio, featuring the ability to synchronize four channels within 1 ns, among other enhancements.

In a joint effort, Rohde & Schwarz and Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Inc., have extensively tested the user plane throughput of the new Qualcomm® Gobi™ 9x35  chipset in compliance with 3GPP Release 10 for LTE-Advanced. In the setup on display at Mobile World Congress, the R&S CMW500 wideband radio communication tester from Rohde & Schwarz simulates the LTE-Advanced network.

M/A-COM Technology Solutions Inc.(“MACOM”), a leading supplier of high-performance RF, microwave and millimeter wave products, announced that it will showcase its industry-leading portfolio of new GaN power products at EDI CON 2014 in Beijing, China, April 8-10, 2014. The company will particpate in the event as an exhibitor in Booth #612 and in the conference as a presenter in the peer-reviewed technical session, workshops and special GaN expert panel to be sponsored by Richardson RFPD.

Integrated circuits and semiconductor technology are critical to the overall performance of electronic systems, whether the application is for mobile communications, radar or satellite navigation. The design track reflects the industry’s focus on recent advances in design technology with an emphasis on specific components such as filters and power amplifiers. Doherty and class-F PA architectures along with techniques such as digital pre-distortion and envelop tracking that are garnering so much industry attention at the moment will be among the hot topics presented in the field of power amplifier design.

Peregrine Semiconductor Corp. has announced the China debut of its UltraCMOS® Global 1, reconfigurable RF front end (RFFE) at EDI CON 2014. Company representatives will hold a special on-site press conference for local media serving the wireless industry in China. The new device which was initially introduced at Mobile World Congree in Barcelona supports over 40 frequency bands and a more than 5,000-fold increase in the number of possible operating states, a truly reconfigurable RFFE is now a requirement. This level of reconfigurability is only feasible with a CMOS process. Global 1’s entire system – multimode, multiband (MMMB) power amplifier; post-PA switch; antenna switch; and antenna tuner, on a single chip – is based on Peregrine’s UltraCMOS 10 technology platform. For the first time, 4G LTE platform providers and OEMs will be able to save time and money by creating a single-SKU design for global markets.

Nutaq, a provider of integrated hardware and software solutions for signal processing applications in mil/aero, wireless, life sciences, and high energy physics, announced that it has been selected by UCLA’s Crump Institute for Medical Imaging to provide the PicoDigitizer 125-32 for Positron Emission Tomography (PET) algorithm development.

Skyworks Solutions Inc., an innovator of high performance analog semiconductors enabling a broad range of end markets, unveiled a set of antenna switch solutions supporting LTE, LTE-Advanced and next-generation carrier aggregation architectures.  The portfolio includes highly integrated antenna switch modules (ASM) as well as transmit and receive diversity switches.  The dual-mode MIPI® RFFE-compliant modules are modem agnostic, making them compatible with every leading chipset provider.

TEGAM signed an agreement with AR Europe, a subsidiary of Amplifier Research (Souderton, PA), that will streamline sales and improve customer support in Europe. Now, TEGAM RF instrumentation, such as the PM Series of RF power sensor calibrators, the 1830A RF power meter, and TEGAM attenuation measurement systems, will be available from Amplifier Research subsidiaries throughout Europe.
 

Raytheon Co. announced today that under the DARPA Microsystems Technology Office (MTO) Wide Bandgap Semiconductor Program, the company has systematically matured Gallium Nitride (GaN) from basic material to transistors, Monolithic Microwave Integrated Circuits (MMICs), Transmit/Receive (T/R) Modules and finally Transmit/Receive Integrated Multichannel Modules (TRIMMs), enabling game changing system performance for the DoD.  

TEGAM Inc., a leading supplier of innovative RF power measurements, was recently awarded Patent No. 8,610,069, “Coaxial to Dual Co-Planar Waveguide Launcher for Microwave Bolometry,” This patent describes a new way to construct bolometers—a type of microwave power sensor that uses thermistors—that makes them more accurate and easier to assembly.