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VadaTech announces the AMC587 and AMC588. These modules couple high-performance RF front end with an XCVU13P providing signal processing bandwidth at over 20 TeraMACs of DSP compute performance in the compact AdvancedMC (AMC) form factor.
TE Connectivity (TE) is pleased to announce it has partnered with Annapolis Micro Systems on the release of three of their new high performance FPGA boards that feature TE’s NanoRF module.
NI announced two series of new millimeter wave radio heads for the mmWave Transceiver System. The new radio heads, which cover spectrum from 24.5 to 33.4 and 37 to 43.5 GHz, are targeted at wireless researchers prototyping 5G New Radio (NR) systems.
Leti and Soitec announced a new collaboration and five-year partnership agreement to drive the R&D of advanced engineered substrates, including SOI and beyond.
Over 8,400 attendees visited Philadelphia between June 10–15 for the IEEE MTT-S 2018 International Microwave Symposium (IMS), further cementing IMS as an essential event for the RF and microwave industry.
China Mobile Terminal Co. Ltd. together with the China Mobile Research Institute, on behalf of China Mobile, signed MoU with 28 partners. Rohde & Schwarz signed the MoU for the 5G Device Forerunner Initiative as a representative of the T&M industry.
Skyworks Solutions announced that Nest, a division of Google (Alphabet), is using several of its wireless connectivity products in their recently launched video doorbells.
Advanced Thermal Solutions Inc. (ATS) is pleased to announce a series of monthly, online webinars covering different aspects of the thermal management of electronics.
“The rate of component obsolescence has increased over the last 15 years,” says Steve Hopwood, senior application engineer at Knowles Precision Devices (KPD).
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