RF & Microwave Industry News

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Cuming Microwave announced a new microwave absorber for use in cavity resonance suppression between 800 MHz – 18 GHz. C-RAM™ RGD-S-192 is a thin, flexible, highly magnetically loaded silicone absorber used in applications where performance cannot be traded for a thicker material. C-RAM™ RGD-S-192 is standard at 0.040’’ (1.01 mm) thick and is ideal for suppressing waves within cavities of microwave modules and other electronics where physical space is limited.

Guerrilla RF, Inc., a leading provider of high performance MMICs, is pleased to announce the introduction of our family of 5GHz low noise amplifiers. The GRF25xx family is a series of ultra-low noise amplifiers (LNAs) designed for IEEE 802.11a/n/ac applications in the 5GHz band (4.9GHz to 5.95GHz). These devices exhibit best-in-class noise figures (NFs) as low as 0.6 dB across the band, along with excellent gain and high linearity. Furthermore, they can be biased with Vdd from 2.7 to 5.0 volts with adjustable current to suit linearity requirements.

Crane Aerospace & Electronics Microwave Solution launches the new ku-band 4-way Iso-Divider designed for use in satellite applications. This unit represents a further expansion of the products available in this product line. The Iso-Divider combines the functions of high performance power dividers with ferrite isolators to provide a high isolation power divider solution, making the external isolators redundant, for satellite receiver applications, without introducing complex switch-based solutions.

Pasternack Enterprises, Inc., an industry leading manufacturer and supplier of RF, microwave and millimeter wave products, releases a new family of high frequency, WR-15 waveguide antennas, which are perfectly designed for high-bandwidth applications including point-to-point links, GigE wireless LAN, millimeter radiometry, uncompressed HD video, FMCW radar, millimeter scintillometry, campus networks and multi-gigabit wireless communications.

Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the addition of six new sales channel partners in the EMEA and Asia Pacific regions. The channel partners have been appointed to drive design wins for UltraCMOS high-performance analog (HPA) products in these important markets. To serve EMEA, Peregrine has appointed Interlligent, Link Microtek and Vostock. In the Asia Pacific region, Peregrine has appointed Asiacom, Tecnomic and Acromax.

Analog Devices Inc. introduced today three new phase-locked loop (PLL) devices one of which features the industry's widest frequency coverage and lowest voltage-controlled oscillator (VCO) phase noise in a single device. Targeted at RF and microwave communications systems designers who need a single, high-performance wideband synthesizer, the ADF5355 PLL covers a 55 MHz to 14 GHz frequency spectrum, the widest in its class, while the ADF4355-2 PLL features a 55 MHz to 4.4 GHz frequency span. Both PLLs integrate ultra-low-phase-noise VCOs that deliver -133 dBc/Hz @ 1 MHz offset at 6 GHz—at least 2 dB lower noise performance than any competing device.

Agilent Technologies Inc. and Cascade Microtech, Inc. announced a strategic alliance to provide fully configured and validated RF measurement solutions that streamline wafer-level semiconductor measurements  while delivering guaranteed configuration, installation and support.

Intercept Technology Inc., a leader in PCB/Hybrid/RF electrical engineering applications, launched an enhanced bidirectional link between Intercept's Mozaix schematic and Pantheon layout design applications and Agilent's ADS software.  By utilizing Agilent's enhanced ADS Board Link (ABL) data transfer format, Intercept leads the way to a streamlined PCB integration with greater flexibility of data transfer and easier management of data integrity. 

Indium Corporation’s Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s assembly, cleaning, and reliability hands-on Workshop on June 10 in Franklin, Mass.

Annual wireless connectivity chipset shipments across Bluetooth, Wi-Fi, NFC, GPS, and ZigBee show no sign of slowing down, reaching almost nine billion annual shipments in 2019, finds ABI Research. Had it not been for combo chipsets and integrated platforms the number of chipsets shipped would have been even higher. Cumulative chipset shipments from 2010 through 2014 will have reached over 21 billion; during the next five years from 2015 to 2019, cumulative shipments will almost double to over 39 billion. “That is over 60 billion wireless connectivity chipsets that will have shipped over the ten year span from 2010 to 2019, driven by the emergence of new device types,” said research director Philip Solis. “There is constant change in the wireless connectivity space across wireless connectivity technologies, versions of technologies, and levels of integration at the same time.”