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Smiths Interconnect will be in Booth #1441 at the International Microwave Symposium (IMS) in Honolulu, Hawaii, and one of the many integrated microwave assemblies (IMAs) that they will be talking about includes a recently released Ku-Band High Power Transceiver (HPT).
Diamond Microwave has announced the streamlining of its range of compact microwave GaN-based pulsed solid-state power amplifiers (SSPA) onto two common platforms, along with the introduction of new X-Band 400 and 900 W "smart" PA models.
Keysight Technologies, Inc. announced the industry’s first scalable PXIe microwave signal generator with frequency coverage up to 44 GHz and modulation bandwidth up to 1 GHz for generating complex waveforms used in emerging 5G and aerospace and defense DVT applications.
Keysight Technologies, Inc. announced a collaboration with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to enable the realization of 5G technologies.
Qorvo® introduced the smallest, high power bulk acoustic wave (BAW) filter that handles 5 W average RF input power, with peaks to 40 W, across 2575 to 2635 MHz.
Copper Mountain Technologies (CMT) introduces 10 new products at the International Microwave Symposium (IMS) held June 4-9 at the Hawaii Convention Center in Honolulu.
W. L. Gore & Associates (Gore) has introduced the new GORE® PHASEFLEX® Microwave/RF Test Assemblies, Type 0N for High Density Test/Interconnection–a lightweight assembly that ensures consistent, repeatable measurements with stable electrical performance up to 50 GHz.
W. L. Gore & Associates (Gore) continues to enhance the company’s microwave/RF solutions to operate at higher frequencies while performing reliably over time.
Tektronix, Inc. introduced the new 5 Series MSO mixed signal oscilloscope that redefines the midrange oscilloscope with a host of innovations delivering unprecedented flexibility and unmatched visibility into complex embedded systems.
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