RF & Microwave Industry News

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Smart Equipment Technology (SET), a leading supplier in high accuracy die-to-die and die-to-wafer bonders, announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies, using direct copper-to-copper bonding.

Zentech Manufacturing is pleased to announce that Greg Rodgers has joined the Zentech Manufacturing Inc. team as director, business development/Delaware Valley Region.

Keysight Technologies Inc. introduced the Keysight Distinguished University Program; a program designed to identify and acknowledge educational excellence in creating industry-ready engineers. The program provides a strong level of cooperation and support between each participating University and Keysight. The program also creates a process to engage students in industry-related projects based on the latest technologies.

Nokia and Alcatel-Lucent celebrate their first day of combined operations, marking the completion of Nokia's latest transformation and the creation of a global leader in technology and services for an IP connected world.

Communications & Power Industries LLC, Beverly Microwave Division, a major supplier of microwave and millimeter wave components and subsystems, announced it has signed an agreement with C-Wave, a manufacturer’s representative located in Los Angeles, Calif.

Qualcomm Inc. and TDK Corp. announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore PTE. Ltd.

Rogers Corp.'s Power Electronics Solutions (PES) group plans a strong presence at the upcoming SPIE Photonics West Conference and Exhibition, set for February 13-18, 2016 in San Francisco’s famed Moscone Center.

Ampleon announced the release of a comprehensive portfolio of overmoulded plastic (OMP) RF power transistors using the well known, extremely rugged LDMOS technology.

RJR Polymers, a leading developer of high performance liquid crystal polymer (LCP) Air Cavity semiconductor packaging (ACP), announced that it has changed its name to RJR Technologies Inc. The new name reflects the company’s growing role as a leading developer and high volume manufacturer of high performance LCP Air Cavity plastic packaging for RF and microwave applications. The company will begin operating under its new name and form a new website, www.rjrtechnologies.com, immediately.

CRFS is expanding its Fairfax, Va. operations to support a range of U.S. DoD programs with commercial-off-the-shelf, SWaP-C optimized, real-time RF solutions.