RF & Microwave Industry News

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Altium Ltd., a global leader in electronic design automation, native 3D PCB design systems, ECAD design data management and embedded software development toolkits, announced PCBWorks, a new PCB design tool created to enhance workflow collaboration between electrical and mechanical designers.

OMMIC has appointed distribution firm NPK Fotonika to serve customers in the Russian Federation.

The European Space Agency has awarded Roke Manor Research Ltd. and its partners, the University of Strathclyde and SCISYS, a contract to support the SysNova initiative for the development of new technologies in the space field.

DiTom Microwave has received a contract from a major U.S. satellite manufacturing company for K-Band space qualified hardware. Under the contract agreement, DiTom will supply these components for a commercial payload.

Harris Corp. and Exelis, Inc. announced a definitive agreement under which Harris will acquire Exelis in a cash and stock transaction valued at $23.75 per share, or an approximately $4.75 billion enterprise value. The agreement has been unanimously approved by the boards of directors of both companies. The transaction is expected to close in June 2015 and is subject to customary closing conditions, including regulatory and Exelis shareholder approval.

GigOptix Inc., a leading supplier of advanced high speed semiconductor components for use in long-haul, metro, cloud and data center connectivity, consumer electronics and interactive applications, announced its newest linear quad-channel modulator driver, the GX62476, for low-power coherent metro applications.

Ericsson and Chinese Academy of Information and Communications Technology (CAICT) announced the signing of a memorandum of understanding (MoU) to launch joint research and development of 5G, the next generation of mobile technologies.

Intel Corp. has signed a definitive agreement to acquire Lantiq, a leading supplier of broadband access and home networking technologies. The transaction is subject to customary closing conditions and regulatory approvals. The transaction is expected to close in approximately 90 days. Deal terms were not disclosed.

Molex Inc., one of the world’s leading electronic connector companies, has launched a new product family of MediSpec™ Non-magnetic RF (radio frequency) Contacts and Modules as an extension to its existing line of RF/Microwave interconnect solutions. 

Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, introduces the UltraCMOS® PE42524, the industry’s first RF SOI switch to operate up to 40 GHz.