We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
Renesas Electronics Corporation announced a strategic partnership with Jariet Technologies, Inc., a designer of ultra-high speed data converters, mixed-signal and RF technologies.
A merger between Curvalux UK Ltd and Cambridge Broadband Networks Group (CBNG) was completed to achieve the technology innovation required to realise the ever-increasing global demand for high speed FWA.
Lockheed Martin and Verizon flew 5G-enabled drones to capture and securely transfer high speed, real-time intelligence, surveillance and reconnaissance (ISR) data from aircraft in flight to geolocate military targets.
Teledyne e2v announce the delivery of qualified flight models of its advanced, space qualified, quad core Cortex-A72 edge processing platform—the LS1046-space.
The GSMA has successfully concluded the first edition of MWC Las Vegas, in partnership with CTIA, which once again showed that MWC is the place to do business.
Junkosha unveiled its new Cable Assembly Designer; a product selection tool for Junkosha’s microwave and mmWave coaxial cable assemblies, at European Microwave Week (EuMW) in Milan.
Qualcomm has begun sampling the Qualcomm X100 5G RAN Accelerator Card and Qualcomm QRU100 5G RAN Platform to global customers and partners for integration and verification of next-generation 5G mobile infrastructure solutions.
TheStrategy Analytics Advanced Semiconductor Applications (ASA) report “RF GaAs Device Technology and Market Forecast: 2021 - 2026” identifies 5G devices and networks as the primary reason for this growth, but it also points out some trouble on the horizon.