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ThinKom Solutions, Inc. and SNC have successfully integrated the ThinAir® GT 2517 on SNC’s RAPCON-X aircraft to support SNC’s contractor-owned, contractor-operated service programs.
According to ABI Research, Wi-Fi HaLow technology is poised to transform the IoT market, with its adoption expected to surge from several million Wi-Fi HaLow-enabled devices in 2024 to over 100 million by 2029.
Murata Manufacturing Co., Ltd has expanded its innovative wireless communication module lineup by introducing the new Type 2FR/2FP and Type 2KL/2LL modules.
Menlo Micro welcomed Under Secretary of Defense for Research and Engineering Heidi Shyu to Menlo Micro’s headquarters to discuss the widespread applications of its technology and the company’s continued work with the Department of Defense (DOD).
With the new ICI-DP set from Langer EMV-Technik more sophisticated EM fault injection attacks are possible allowing detailed research of secure elements.
The Rohde & Schwarz Mobile Test Summit was held over two days, where wireless communications professionals were invited to engage in discussions on the latest developments in mobile device and infrastructure testing.
Soitec announced the continuation of its research collaboration with the Microsystems Technology Laboratories (MTL) of the Massachusetts Institute of Technology (MIT), further solidifying its presence in the North American semiconductor sector.
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