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Junkosha has chosen Europe’s premier microwave, RF, wireless and radar event, European Microwave Week (EuMW), to launch its new ePTFE tape wrapped phase and amplitude stable MWX7 Series of cables.
EMITE and Anritsu Corporation announced their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth® wireless technology.
Mercury Systems, Inc. announced it received a $4 million order from a leading commercial technology company for advanced Si packaging to be used in electronic warfare, AESA beamforming and C4ISR systems.
ADI’s stand (number 56) at EuMW will feature live demonstrations across the broad RF spectrum from component selection through basic circuit block integration to full system level platforms.
After the successful completion of Phase 1, DARPA has provided BAE Systems’ FAST Labs a $5 million contract for Phase 2 of the Technologies for Mixed-mode Ultra Scaled Integrated Circuits (T-MUSIC) program.
The MwT-9F70 GaAs MESFET delivers 26.5 dBm P1dB at 12 GHz and is ideally suited to applications requiring high gain and medium linear power in the 500 MHz to 26 GHz frequency range.
Analog Devices, Inc. (ADI) introduced a mmWave 5G front-end chipset that addresses required frequency bands enabling designers to reduce complexity and bring smaller and more versatile radios to market faster.
IDTechEx’s latest research report on “Thermal Management for 5G 2022-2032” finds that GaN has a significant opportunity within the 5G market and this creates a downstream effect on other components such as die attach materials.
The Open RF Association announced it completed the initial phase, in collaboration with Signals Research Group, of a study determining RF power levels used in 5G handsets to help the industry better optimize data throughput performance and ultimately improve battery life.