We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
EnSilica announced that it has been awarded an $18 million design and supply contract by a leading European based supplier of electromechanical products for a Cortex M series Arm-based mixed signal sensor interface ASIC.
ATIS’ Next G Alliance (NGA) announced the release of the 6G Component Technologies White Papers Series, four pieces that address critical technologies that will contribute to North American leadership in the 6G future.
NTT Corporation, NTT DOCOMO, INC. and NEC Corporation announced that they demonstrated a real-time bidirectional wireless transmission in the mmWave band between 71 GHz and 86 GHz that achieved a bit rate of 140 gigabits per second.
Sivers Semiconductors AB announced a partnership with WIN Semiconductors to enhance production of Sivers Semiconductors’ proprietary high-power DFB lasers and laser arrays technology.