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The Open RF Association (OpenRF™) announced the next evolution of its mission to improve time-to-market, enhance operational benefits and reduce overall costs for wireless device OEMs.
Renesas Electronics Corporation announced a strategic partnership with Tata Motors Ltd. and Tejas Networks Ltd. on the design, development and manufacturing of Renesas’ semiconductor solutions for enhancing innovation across electronics systems for the Indian and emerging markets.
Purdue University’s College of Engineering is partnering with MediaTek Inc. to open the Midwest’s first semiconductor chip design center, to be housed on Purdue’s campus.
The Wireless Broadband Alliance (WBA) published “Wi-Fi 6/6E for Industrial IoT: Enabling Wi-Fi Determinism in an IoT World,” exploring how Wi-Fi’s latest features are ideal for meeting the unique, demanding requirements for a wide variety of existing and emerging IIoT applications.
Keysight Technologies, Inc. announced the results of a global study, conducted by Forrester, that surveyed test operations decision-makers to understand the state of test strategies and technologies.
Orolia has released Skydel 22.5, a significant software upgrade to its Skydel simulation product line that features advanced hardware-in-the-loop (HIL) testing solutions providing very low to zero-effective-latency.
Indium Corporation announced that Brian Rundell has joined the company as a technical support engineer based at the company’s headquarters in Clinton, NY.
Q-Tech Corporation introduces the QTCC353 Series of miniature SMD crystal oscillators designed to provide superior performance over MEMS devices in a wide-range of non-space military, communications, instrumentation and avionics applications.
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