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Test Equipment Direct-sequence Spread Spectrum Board The model DEV6143 full-duplex-mode reprogrammable development board, in conjunction with the company’s SX043 and SX061, provides a prototype platform for users and allows designers to set up internal registers to perform a complete evaluation of an IC. The unit’s full-duplex mode consolidates the...

Amplifiers 50 W Broadband Power Amplifier This high performance 50 W RF power amplifier covers a broad frequency range from 500 to 1000 MHz. The amplifier is available as a 28 V DC module and features a gain of 30 dB (typ). The unit is also available as a...

Antennas Embedded OEM Component Antennas The Performa series embedded original equipment manufacturer (OEM) component antennas operate in the 2.4 and 5 GHz frequency bands and are designed specifically to enhance machine-to-machine communications in wireless LAN and remote monitoring applications. The antennas rely on the company’s patent-pending C-Planar™ technology, which...

Devices 600 W Magnetron The model IMG-915-600WA 915 MHz CW fixed-tuned, permanent magnet-focused magnetron features ceramic-metal construction, air cooling and rugged construction for laboratory and low power production industrial applications. Smooth power control from 120 to 600 W may be achieved by varying the anode voltage. The unique cathode...

Integrated Circuits MMIC Power Amplifier Chips The TGA1073A, B, C and G power amplifier MMIC devices cover the 19 to 41 GHz frequency band and were designed using the company’s 0.25 mm power pHEMT GaAs production process to provide the highest possible millimeter-wave performance. These devices may be operated...

Materials Foam Powder ECCOSTOCK“ FFP is a one-part, free-flowing syntactic foam powder for low loss, low dielectric constant and low thermal conductivity microwave applications. It infiltrates densely populated electronic packages, filling open spaces around delicate components. This epoxy-based material can be cured at temperatures as low as 100°C (212°F),...

Packaging Integrated Package The UltraPack™ integrated package for high powered microwave amplifiers is capable of operating in three different modes, including impingement cooling mode, common horizontal cooling mode and natural convection mode. For the first time, pins are implanted directly into the microwave housing base, eliminating the heat sink’s...

Processing Equipment Epoxy Cure Oven The model 2100 epoxy cure oven for leadframes is fully equipped with four individually controlled temperature zones. The fully programmable oven is an integration companion piece that can be combined with any of the company’s epoxy die and wire bonders. F&K Delvotec Inc., Foothill...

Software Base Station Testing Software The AutoCell 882/884 software application is designed to automate and simplify testing of Ericsson 884 and 882 legacy base stations using the IFR-1900 CSA. The user-friendly program is dual-banded for 800 and 1900 MHz applications and performs modulation quality, adjacent-channel power, analog- and digital-mode...

Around the Circuit INDUSTRY NEWS Defense contractor General Dynamics Corp. , Falls Church, VA, has signed an agreement valued at $1.05 B to acquire three defense electronics units of GTE Corp. 's government systems organization. The operations are considered prime assets in the defense markets as the industry continues...