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Teledyne e2v announced engineering models of the LX2160-Space 16-core Arm® Cortex® A72 based system on chip (SoC) processor, enabling early project design, hardware and software validation for space-demanding applications.
AMD expanded of the AMD Versal™ adaptive system-on-chip (SoC) portfolio with the introduction of the Versal RF Series that includes the industry’s highest compute performance in a single-chip device with integrated direct RF-sampling data converters.
Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide-free and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
Remcom announced the integration of XFdtd® 3D Electromagnetic Simulation Software with Wireless InSite® 3D Wireless Propagation Software through a new Huygens surface capability.
Arctic Instruments has raised EUR 2.35 million in funding for the research, development and commercialisation of its superconducting microwave amplifier technology.
According to a recently published report from Dell’Oro Group, total global revenue for the broadband access equipment market increased to $4.6 billion in 3Q 2024, up 1 percent Q/Q and 5 percent year-over-year (Y/Y).
Global electronic test and measurement equipment specialist Electro Rent has appointed Alan Mayer as its chief revenue officer to spearhead the company’s growth plans.
SynaXG announced its membership in the AI-RAN Alliance, a collaborative initiative aimed at integrating AI into cellular technology to advance radio access network (RAN) technology and mobile networks.
DARPA has awarded BAE Systems’ FAST Labs™ research and development organization a $12 million contract as part of the High Operational Temperature Sensors (HOTS) program.
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