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With the new ICI-DP set from Langer EMV-Technik more sophisticated EM fault injection attacks are possible allowing detailed research of secure elements.
Soitec announced the continuation of its research collaboration with the Microsystems Technology Laboratories (MTL) of the Massachusetts Institute of Technology (MIT), further solidifying its presence in the North American semiconductor sector.
Anritsu and Bluetest have combined their recent product upgrades to create an OTA measurement solution in a MIMO environment for verification of RF performance in the tri-frequency bands of the latest WLAN Wi-Fi 7 standard (IEEE 802.11be).
ETS-Lindgren and Rohde & Schwarz continue their long-standing partnership to deliver comprehensive OTA testing solutions for next-generation wireless technologies.
Qualcomm Incorporated announced the appointment of Dr. Baaziz Achour to the role of chief technology officer (CTO), Qualcomm Technologies, Inc., and the retirement of Dr. James Thompson, each effective February 3, 2025.
Mercury Systems, Inc. introduced a system on module (SoM) and 3U SOSA-aligned OpenVPX board powered by Altera’s™ most advanced Agilex 9 Direct RF FPGA chips.
With its new R&S NRPxE RF power sensors, Rohde & Schwarz sets a new standard for accurate and reliable power measurements in frequency ranges up to 18 GHz.
NXP Semiconductors announced that its continued strategic collaboration with geo to leverage geo's deep experience in energy management and NXP's intelligent system solutions for Matter.